Enhanced flow boiling heat transfer from 3D printed substrates
Ever since Moore's law earned its place as an annual target for the semiconductor industry, it is evident that the exponential surge in circuit density is not exempted from huge increase in heat flux. Thus, the need to manage heat transfer is crucial as we expect heat dissipation to rise along...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2016
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| Online Access: | http://hdl.handle.net/10356/67385 |