Integrated thermal management of electronics
With the rapid advancement of technology, the form factor of integrated circuits decreases. This has resulted in the reduction in the available area of heat dissipation causing a high level of heat flux to develop which certain integrated circuits are unable to withstand. Therefore, in order to main...
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| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2016
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| Online Access: | http://hdl.handle.net/10356/67650 |