Development of Pb-free solder for electronic assembly
This project aimed (1) to look for new lead-free solder alloy systems with improved properties for electronic packaging and assembly, (2) to study the effects of microstructural evolution on the reliability of the solder joints, and (3) to investigate the growth kinetics of the IMC formation in sold...
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| Format: | Research Report |
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2008
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| Online Access: | http://hdl.handle.net/10356/6781 |
| _version_ | 1811678165894955008 |
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| author | Li, Guoyuan. |
| author2 | School of Materials Science & Engineering |
| author_facet | School of Materials Science & Engineering Li, Guoyuan. |
| author_sort | Li, Guoyuan. |
| collection | NTU |
| description | This project aimed (1) to look for new lead-free solder alloy systems with improved properties for electronic packaging and assembly, (2) to study the effects of microstructural evolution on the reliability of the solder joints, and (3) to investigate the growth kinetics of the IMC formation in solder joints based on establishing new theoretical model. |
| first_indexed | 2024-10-01T02:48:56Z |
| format | Research Report |
| id | ntu-10356/6781 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T02:48:56Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/67812023-07-08T06:39:16Z Development of Pb-free solder for electronic assembly Li, Guoyuan. School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects This project aimed (1) to look for new lead-free solder alloy systems with improved properties for electronic packaging and assembly, (2) to study the effects of microstructural evolution on the reliability of the solder joints, and (3) to investigate the growth kinetics of the IMC formation in solder joints based on establishing new theoretical model. 2008-09-17T14:24:47Z 2008-09-17T14:24:47Z 2004 2004 Research Report http://hdl.handle.net/10356/6781 Nanyang Technological University 102 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Li, Guoyuan. Development of Pb-free solder for electronic assembly |
| title | Development of Pb-free solder for electronic assembly |
| title_full | Development of Pb-free solder for electronic assembly |
| title_fullStr | Development of Pb-free solder for electronic assembly |
| title_full_unstemmed | Development of Pb-free solder for electronic assembly |
| title_short | Development of Pb-free solder for electronic assembly |
| title_sort | development of pb free solder for electronic assembly |
| topic | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects |
| url | http://hdl.handle.net/10356/6781 |
| work_keys_str_mv | AT liguoyuan developmentofpbfreesolderforelectronicassembly |