Report on industrial attachment with Micron Semiconductor Asia Pte Ltd

This report emphazised on the two projects assigned to author during IA. The projects are Die Mount Evaluation of New Flip Chip Package and Materials Characterization and Evaluation on Adhesive Tapes.

Bibliographic Details
Main Author: Lao, Luciana Lisa.
Other Authors: School of Materials Science & Engineering
Format: Industrial Attachment (IA)
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/6796
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author Lao, Luciana Lisa.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Lao, Luciana Lisa.
author_sort Lao, Luciana Lisa.
collection NTU
description This report emphazised on the two projects assigned to author during IA. The projects are Die Mount Evaluation of New Flip Chip Package and Materials Characterization and Evaluation on Adhesive Tapes.
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institution Nanyang Technological University
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spelling ntu-10356/67962023-03-04T15:40:24Z Report on industrial attachment with Micron Semiconductor Asia Pte Ltd Lao, Luciana Lisa. School of Materials Science & Engineering DRNTU::Engineering::Materials This report emphazised on the two projects assigned to author during IA. The projects are Die Mount Evaluation of New Flip Chip Package and Materials Characterization and Evaluation on Adhesive Tapes. 2008-09-17T14:27:22Z 2008-09-17T14:27:22Z 2002 2002 Industrial Attachment (IA) http://hdl.handle.net/10356/6796 Nanyang Technological University 126 p. application/pdf
spellingShingle DRNTU::Engineering::Materials
Lao, Luciana Lisa.
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
title Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
title_full Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
title_fullStr Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
title_full_unstemmed Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
title_short Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
title_sort report on industrial attachment with micron semiconductor asia pte ltd
topic DRNTU::Engineering::Materials
url http://hdl.handle.net/10356/6796
work_keys_str_mv AT laolucianalisa reportonindustrialattachmentwithmicronsemiconductorasiapteltd