Fabrication and characterization of Algan/Gan high electron mobility transistors on silicon
“Moore’s Law” states that the number of transistors in an integrated circuit will double approximately every two years. True to this observation, the number of transistors per Si IC indeed has doubled every 18 months since the 1970s. In accordance with the scaling trend predicted in Moore’s Law, not...
Main Author: | Tham, Wai Hoe |
---|---|
Other Authors: | Lakshimi Kanta Bera |
Format: | Thesis |
Language: | English |
Published: |
2016
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/67970 |
Similar Items
-
Effect of OFF-state stress induced electric field on trapping in AlGaN/GaN high electron mobility transistors on Si (111)
by: Anand, M. J., et al.
Published: (2015) -
ZrO2 as high-K gate dielectric for GaN-based transistors
by: Ye, Gang
Published: (2016) -
Ga-bilayer controlled AlGaN/GaN HEMT structure grown on Si by PA-MBE
by: Agrawal, M., et al.
Published: (2011) -
Demonstration of submicron-gate AlGaN/GaN high-electron-mobility transistors on silicon with complementary metal-oxide-semiconductor-compatible non-gold metal stack
by: Arulkumaran, Subramaniam, et al.
Published: (2015) -
Studies of interface traps in GaN High-Electron-Mobility-Transistors (HEMTs)
by: Phia, Chen Yew
Published: (2020)