High speed data link for 3DICs
The transistor scaling predicted by Moore's Law has driven the development of the semiconductor industries for many decades. As the lithography process approaches to its limit, research and development cost for a new technology node starts to increase as well as the cost of fabrication. As the...
Main Author: | Aung, Myat Thu Linn |
---|---|
Other Authors: | Kim Tae Hyoung |
Format: | Thesis |
Language: | English |
Published: |
2016
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/68703 |
Similar Items
-
Design of simultaneous bi-directional transceivers utilizing capacitive coupling for 3DICs in face-to-face configuration
by: Aung, Myat Thu Linn, et al.
Published: (2013) -
Design analysis of data links in 2.5 dics
by: Visamangalam Thattai Lakshminarayanan
Published: (2015) -
Design analysis of data links in 2.5DICs
by: Visamangalam Thattai Lakshminarayanan
Published: (2015) -
Design of low noise amplifier (LNA) for WiMax applications
by: Aung Myat Thu Linn
Published: (2010) -
High strain rate and elevated temperature compressive properties of magnesium alloy AZ31B
by: Myat, Thu.
Published: (2012)