Forced convection and sub-cooled flow boiling heat transfer from electronic chips
Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water & FC-72.
Main Authors: | Tou, Kwok Woon., Tso, Chih Ping. |
---|---|
Other Authors: | School of Mechanical and Production Engineering |
Format: | Research Report |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/6902 |
Similar Items
-
Ultra-thin bulk silicon thinning of advanced microprocessors & graphics processors fabricated in Sub-20 nm technology
by: Teo, Wee Siang
Published: (2020) -
Characterization and structural modification of polysilsesquioxanes for low dielectric constant (k) applications in deep sub-micron devices
by: Siew, Yong Kong.
Published: (2008) -
Metal-doped polymeric photocatalysts for solar fuels production
by: Ruan, Liyan
Published: (2023) -
Determination of metallic content in various components in waste PCB for recycling via hydrometallurgical process
by: Kasogi, Abraham Nathanael
Published: (2020) -
Structure and phase engineering of 2D transition metal chalcogenides
by: Tang, Bijun
Published: (2021)