Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits
The purpose of this project is to characterize moisture-temperature-dependent mechanical behavior of molding compounds, and chemo-hygro-thermo-rheologically complex material behaviors of thermosetting molding compounds with various filler contents during the curing processes. Both finite element mod...
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| Format: | Research Report |
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2008
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| Online Access: | http://hdl.handle.net/10356/6947 |