To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials
Thin-layered structures of dissimilar materials have found increasing applications in many new advanced technologies. For instance, thin-layered structure is an essential feature in electronics packaging and microelectromechanical system (MEMS) device. In these devices, delamination due to crack pro...
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| Format: | Research Report |
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2008
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| Online Access: | http://hdl.handle.net/10356/7014 |
| Summary: | Thin-layered structures of dissimilar materials have found increasing applications in many new advanced technologies. For instance, thin-layered structure is an essential feature in electronics packaging and microelectromechanical system (MEMS) device. In these devices, delamination due to crack propagation of the interface between dissimilar materials is a common failure mode and is strongly dependent on the adhesion strength of the interface. |
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