To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials
Thin-layered structures of dissimilar materials have found increasing applications in many new advanced technologies. For instance, thin-layered structure is an essential feature in electronics packaging and microelectromechanical system (MEMS) device. In these devices, delamination due to crack pro...
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| Format: | Research Report |
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2008
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| Online Access: | http://hdl.handle.net/10356/7014 |
| _version_ | 1811696575651512320 |
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| author | Wan, Kai Tak |
| author2 | School of Mechanical and Aerospace Engineering |
| author_facet | School of Mechanical and Aerospace Engineering Wan, Kai Tak |
| author_sort | Wan, Kai Tak |
| collection | NTU |
| description | Thin-layered structures of dissimilar materials have found increasing applications in many new advanced technologies. For instance, thin-layered structure is an essential feature in electronics packaging and microelectromechanical system (MEMS) device. In these devices, delamination due to crack propagation of the interface between dissimilar materials is a common failure mode and is strongly dependent on the adhesion strength of the interface. |
| first_indexed | 2024-10-01T07:41:33Z |
| format | Research Report |
| id | ntu-10356/7014 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T07:41:33Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/70142023-03-04T18:09:08Z To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials Wan, Kai Tak School of Mechanical and Aerospace Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Thin-layered structures of dissimilar materials have found increasing applications in many new advanced technologies. For instance, thin-layered structure is an essential feature in electronics packaging and microelectromechanical system (MEMS) device. In these devices, delamination due to crack propagation of the interface between dissimilar materials is a common failure mode and is strongly dependent on the adhesion strength of the interface. 2008-09-18T05:58:57Z 2008-09-18T05:58:57Z 2006 2006 Research Report http://hdl.handle.net/10356/7014 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Wan, Kai Tak To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials |
| title | To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials |
| title_full | To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials |
| title_fullStr | To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials |
| title_full_unstemmed | To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials |
| title_short | To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials |
| title_sort | to investigate the mechanical adhesion properties and mechanical reliability of thin films in electronics materials |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials |
| url | http://hdl.handle.net/10356/7014 |
| work_keys_str_mv | AT wankaitak toinvestigatethemechanicaladhesionpropertiesandmechanicalreliabilityofthinfilmsinelectronicsmaterials |