Carbon-based materials for thermal management applications
The scaling down of device sizes and the increasing in power dissipation make heat transport and removal a major technological impediment to the future development for electronic applications. Limited heat conduction within devices causes severe localized self-heating problems. Temperature increase...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Language: | English |
| Published: |
2018
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/73962 |