Time-frequency representation as a tool of failure detection
Chemical-Mechanical Planarization, or CMP for short, is one of the final major process involved in semiconductor company when making a microchip. In this process the chip is being made perfectly smooth and flat with the help of chemical and mechanical forces. The tool which does the planarizing proc...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2019
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| Online Access: | http://hdl.handle.net/10356/78702 |
| _version_ | 1826119007881658368 |
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| author | Soeryanto, Yehezkiel |
| author2 | Tegoeh Tjahjowidodo |
| author_facet | Tegoeh Tjahjowidodo Soeryanto, Yehezkiel |
| author_sort | Soeryanto, Yehezkiel |
| collection | NTU |
| description | Chemical-Mechanical Planarization, or CMP for short, is one of the final major process involved in semiconductor company when making a microchip. In this process the chip is being made perfectly smooth and flat with the help of chemical and mechanical forces. The tool which does the planarizing process is a polishing pad which will control the final thickness of the microchip. After a certain period, the polishing pad will lose its profile and if used will give in undesirable result from the polishing process. In order to be reprofiled, the polishing pad will be conditioned. The pad is conditioned by the help of a diamond disc, where it is put and held on conditioning head and it will be moved by the conditioning arm. After some time as well, however, just like any abrasive tools the diamond disc will also wear, degrade and loosen due to the friction between the surface and the diamond disc and it will reduce the life cycle of the disc. To prevent failure for the conditioning process, the current solution for the diamond disc is used for a certain amount of cycle before it was replaced. This, though, made a new issue where diamond discs are not used to their full life cycle. Producer could implement a method to check the diamond disc regularly, however one need to halt the machine to do it and that time will be counted as loss to the company. In this project, the objective is to view the possibility of automating the process of examining the diamond disc in CMP machine with the assistance of Deep Learning through Time-Frequency Analysis approach. Vibration value that will undergone signal processing technique and Neural Networks model as Deep Learning technique will be the scope of the project where a combination of both will be used to determine the possibility of this objective and for further research. |
| first_indexed | 2024-10-01T04:52:59Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/78702 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T04:52:59Z |
| publishDate | 2019 |
| record_format | dspace |
| spelling | ntu-10356/787022023-03-04T18:37:52Z Time-frequency representation as a tool of failure detection Soeryanto, Yehezkiel Tegoeh Tjahjowidodo School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering::Mechatronics Chemical-Mechanical Planarization, or CMP for short, is one of the final major process involved in semiconductor company when making a microchip. In this process the chip is being made perfectly smooth and flat with the help of chemical and mechanical forces. The tool which does the planarizing process is a polishing pad which will control the final thickness of the microchip. After a certain period, the polishing pad will lose its profile and if used will give in undesirable result from the polishing process. In order to be reprofiled, the polishing pad will be conditioned. The pad is conditioned by the help of a diamond disc, where it is put and held on conditioning head and it will be moved by the conditioning arm. After some time as well, however, just like any abrasive tools the diamond disc will also wear, degrade and loosen due to the friction between the surface and the diamond disc and it will reduce the life cycle of the disc. To prevent failure for the conditioning process, the current solution for the diamond disc is used for a certain amount of cycle before it was replaced. This, though, made a new issue where diamond discs are not used to their full life cycle. Producer could implement a method to check the diamond disc regularly, however one need to halt the machine to do it and that time will be counted as loss to the company. In this project, the objective is to view the possibility of automating the process of examining the diamond disc in CMP machine with the assistance of Deep Learning through Time-Frequency Analysis approach. Vibration value that will undergone signal processing technique and Neural Networks model as Deep Learning technique will be the scope of the project where a combination of both will be used to determine the possibility of this objective and for further research. Bachelor of Engineering (Mechanical Engineering) 2019-06-26T01:23:41Z 2019-06-26T01:23:41Z 2019 Final Year Project (FYP) http://hdl.handle.net/10356/78702 en Nanyang Technological University 43 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Mechanical engineering::Mechatronics Soeryanto, Yehezkiel Time-frequency representation as a tool of failure detection |
| title | Time-frequency representation as a tool of failure detection |
| title_full | Time-frequency representation as a tool of failure detection |
| title_fullStr | Time-frequency representation as a tool of failure detection |
| title_full_unstemmed | Time-frequency representation as a tool of failure detection |
| title_short | Time-frequency representation as a tool of failure detection |
| title_sort | time frequency representation as a tool of failure detection |
| topic | DRNTU::Engineering::Mechanical engineering::Mechatronics |
| url | http://hdl.handle.net/10356/78702 |
| work_keys_str_mv | AT soeryantoyehezkiel timefrequencyrepresentationasatooloffailuredetection |