Nondestructive void size determination in copper metallization under passivation
A novel nondestructive failure analysis technique to rapidly locate tiny voids in narrow metallization line covered with passivation is proposed, based on the simulation results. In this technique, the current alteration in a metal line under study is recorded continuously when it is subjected to el...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2009
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/79913 http://hdl.handle.net/10220/4709 |
| _version_ | 1811683081720954880 |
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| author | Gan, Zhenghao Tan, Cher Ming Zhang, Guan |
| author2 | School of Electrical and Electronic Engineering |
| author_facet | School of Electrical and Electronic Engineering Gan, Zhenghao Tan, Cher Ming Zhang, Guan |
| author_sort | Gan, Zhenghao |
| collection | NTU |
| description | A novel nondestructive failure analysis technique to rapidly locate tiny voids in narrow metallization line covered with passivation is proposed, based on the simulation results. In this technique, the current alteration in a metal line under study is recorded continuously when it is subjected to electron beam shining and biased by a small external voltage. Finite-element analysis is performed to simulate the temperature distribution and current alteration in the metal line. The electron-beam heating is demonstrated as the most important factor contributing to the current alteration. Reconstruction of voids with any shape(such as wedge or slit) is possible on the basis of the gradient of the current alteration. It is found that the minimum detectable void size can be as low as 50 nm. Experimental verification of the technique is underway. |
| first_indexed | 2024-10-01T04:07:04Z |
| format | Journal Article |
| id | ntu-10356/79913 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T04:07:04Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | ntu-10356/799132020-03-07T13:57:21Z Nondestructive void size determination in copper metallization under passivation Gan, Zhenghao Tan, Cher Ming Zhang, Guan School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering A novel nondestructive failure analysis technique to rapidly locate tiny voids in narrow metallization line covered with passivation is proposed, based on the simulation results. In this technique, the current alteration in a metal line under study is recorded continuously when it is subjected to electron beam shining and biased by a small external voltage. Finite-element analysis is performed to simulate the temperature distribution and current alteration in the metal line. The electron-beam heating is demonstrated as the most important factor contributing to the current alteration. Reconstruction of voids with any shape(such as wedge or slit) is possible on the basis of the gradient of the current alteration. It is found that the minimum detectable void size can be as low as 50 nm. Experimental verification of the technique is underway. Published version 2009-07-28T03:51:25Z 2019-12-06T13:36:39Z 2009-07-28T03:51:25Z 2019-12-06T13:36:39Z 2003 2003 Journal Article Gan, Z., Tan, C. M., & Zhang, G. (2003). Nondestructive void size determination in copper metallization under passivation. IEEE Transactions on Device and Materials Reliability, (3)3, 69-78. 1530-4388 https://hdl.handle.net/10356/79913 http://hdl.handle.net/10220/4709 10.1109/TDMR.2003.815285 en IEEE transactions on device and materials reliability © 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. 10 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering Gan, Zhenghao Tan, Cher Ming Zhang, Guan Nondestructive void size determination in copper metallization under passivation |
| title | Nondestructive void size determination in copper metallization under passivation |
| title_full | Nondestructive void size determination in copper metallization under passivation |
| title_fullStr | Nondestructive void size determination in copper metallization under passivation |
| title_full_unstemmed | Nondestructive void size determination in copper metallization under passivation |
| title_short | Nondestructive void size determination in copper metallization under passivation |
| title_sort | nondestructive void size determination in copper metallization under passivation |
| topic | DRNTU::Engineering::Electrical and electronic engineering |
| url | https://hdl.handle.net/10356/79913 http://hdl.handle.net/10220/4709 |
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