In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper
In-situ scanning vibrating electrode technique (SVET) combined with other techniques (such as electrochemical impedance spectroscopy (EIS), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS)) was used to investigate the efficiency of the mixed compound of 3-amino-1, 2, 4-triazo...
| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2016
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/81512 http://hdl.handle.net/10220/40846 |
| _version_ | 1826116075577671680 |
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| author | Zhang, Bowei Wu, Junsheng Peng, Dongdong Li, Xiaogang Huang, Yizhong |
| author2 | School of Materials Science & Engineering |
| author_facet | School of Materials Science & Engineering Zhang, Bowei Wu, Junsheng Peng, Dongdong Li, Xiaogang Huang, Yizhong |
| author_sort | Zhang, Bowei |
| collection | NTU |
| description | In-situ scanning vibrating electrode technique (SVET) combined with other techniques (such as electrochemical impedance spectroscopy (EIS), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS)) was used to investigate the efficiency of the mixed compound of 3-amino-1, 2, 4-triazole (ATA) and sodium molybdate (SM) as a corrosion inhibitor for copper in 3.5% NaCl solution in comparison with benzotriazole (BTA). The results indicate that copper shows extremely higher corrosion resistance in 3.5% NaCl solution with the presence of ATA-SM inhibitor than BTA. This is due to the reaction of ATA with copper allowing the formation of a thin film incorporated with MoO4 ion precipitates on the surface of copper, which provides strong cathodic efficiency and thus is considerably protective. |
| first_indexed | 2024-10-01T04:05:29Z |
| format | Journal Article |
| id | ntu-10356/81512 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T04:05:29Z |
| publishDate | 2016 |
| record_format | dspace |
| spelling | ntu-10356/815122023-07-14T15:49:45Z In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper Zhang, Bowei Wu, Junsheng Peng, Dongdong Li, Xiaogang Huang, Yizhong School of Materials Science & Engineering In-situ SVET In-situ scanning vibrating electrode technique (SVET) combined with other techniques (such as electrochemical impedance spectroscopy (EIS), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS)) was used to investigate the efficiency of the mixed compound of 3-amino-1, 2, 4-triazole (ATA) and sodium molybdate (SM) as a corrosion inhibitor for copper in 3.5% NaCl solution in comparison with benzotriazole (BTA). The results indicate that copper shows extremely higher corrosion resistance in 3.5% NaCl solution with the presence of ATA-SM inhibitor than BTA. This is due to the reaction of ATA with copper allowing the formation of a thin film incorporated with MoO4 ion precipitates on the surface of copper, which provides strong cathodic efficiency and thus is considerably protective. MOE (Min. of Education, S’pore) Published version 2016-06-29T08:50:17Z 2019-12-06T14:32:40Z 2016-06-29T08:50:17Z 2019-12-06T14:32:40Z 2016 Journal Article Zhang, B., Wu, J., Peng, D., Li, X., & Huang, Y. (2016). In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper. International Journal of Electrochemical Science, 11, 4110-4119. 1452-3981 https://hdl.handle.net/10356/81512 http://hdl.handle.net/10220/40846 10.20964/110367 en International Journal of Electrochemical Science © 2016 The Authors. Published by ESG (www.electrochemsci.org). This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution license (http://creativecommons.org/licenses/by/4.0/). 10 p. application/pdf |
| spellingShingle | In-situ SVET Zhang, Bowei Wu, Junsheng Peng, Dongdong Li, Xiaogang Huang, Yizhong In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper |
| title | In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper |
| title_full | In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper |
| title_fullStr | In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper |
| title_full_unstemmed | In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper |
| title_short | In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper |
| title_sort | in situ scanning micro electrochemical characterization of corrosion inhibitors on copper |
| topic | In-situ SVET |
| url | https://hdl.handle.net/10356/81512 http://hdl.handle.net/10220/40846 |
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