Effect of cold-work on the Hall–Petch breakdown in copper based micro-components
Effects of substructural dimensions on the mechanical properties of micro-pins produced by an open-die micro-extrusion/forging process were studied. Micro-pins of diameter 0.3 mm were manufactured from copper strips, having different initial grain sizes. Micro-compression tests on the micro-pins rev...
| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2016
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| Online Access: | https://hdl.handle.net/10356/81567 http://hdl.handle.net/10220/39595 |
| _version_ | 1811689710455619584 |
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| author | Ghassemali, Ehsan Tan, Ming-Jen Wah, Chua Beng Lim, S.C.V. Jarfors, Anders E.W. |
| author2 | School of Mechanical and Aerospace Engineering |
| author_facet | School of Mechanical and Aerospace Engineering Ghassemali, Ehsan Tan, Ming-Jen Wah, Chua Beng Lim, S.C.V. Jarfors, Anders E.W. |
| author_sort | Ghassemali, Ehsan |
| collection | NTU |
| description | Effects of substructural dimensions on the mechanical properties of micro-pins produced by an open-die micro-extrusion/forging process were studied. Micro-pins of diameter 0.3 mm were manufactured from copper strips, having different initial grain sizes. Micro-compression tests on the micro-pins revealed no significant size effect, even if the number of grains over the diameter of the micro-pins falls below its critical value. However, relaxation of the as-formed substructure using recovery annealing led to a surprising drop in the flow stress of the micro-pins. This was explained and attributed to the number of subgrains over the diameter of the micro-pins, showing the important role of subgrains rather than grains in determining the mechanical properties. |
| first_indexed | 2024-10-01T05:52:26Z |
| format | Journal Article |
| id | ntu-10356/81567 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T05:52:26Z |
| publishDate | 2016 |
| record_format | dspace |
| spelling | ntu-10356/815672020-09-26T22:11:03Z Effect of cold-work on the Hall–Petch breakdown in copper based micro-components Ghassemali, Ehsan Tan, Ming-Jen Wah, Chua Beng Lim, S.C.V. Jarfors, Anders E.W. School of Mechanical and Aerospace Engineering A*STAR SIMTech Microforming Subgrain Microstructure Size effect Dislocation cells Effects of substructural dimensions on the mechanical properties of micro-pins produced by an open-die micro-extrusion/forging process were studied. Micro-pins of diameter 0.3 mm were manufactured from copper strips, having different initial grain sizes. Micro-compression tests on the micro-pins revealed no significant size effect, even if the number of grains over the diameter of the micro-pins falls below its critical value. However, relaxation of the as-formed substructure using recovery annealing led to a surprising drop in the flow stress of the micro-pins. This was explained and attributed to the number of subgrains over the diameter of the micro-pins, showing the important role of subgrains rather than grains in determining the mechanical properties. ASTAR (Agency for Sci., Tech. and Research, S’pore) Accepted version 2016-01-06T07:04:07Z 2019-12-06T14:33:54Z 2016-01-06T07:04:07Z 2019-12-06T14:33:54Z 2014 Journal Article Ghassemali, E., Tan, M.-J., Wah, C. B., Lim, S., & Jarfors, A. E. (2015). Effect of cold-work on the Hall–Petch breakdown in copper based micro-components. Mechanics of Materials, 80124-135. 0167-6636 https://hdl.handle.net/10356/81567 http://hdl.handle.net/10220/39595 10.1016/j.mechmat.2014.10.003 en Mechanics of Materials © 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Mechanics of Materials, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.mechmat.2014.10.003]. 32 p. application/pdf |
| spellingShingle | Microforming Subgrain Microstructure Size effect Dislocation cells Ghassemali, Ehsan Tan, Ming-Jen Wah, Chua Beng Lim, S.C.V. Jarfors, Anders E.W. Effect of cold-work on the Hall–Petch breakdown in copper based micro-components |
| title | Effect of cold-work on the Hall–Petch breakdown in copper based micro-components |
| title_full | Effect of cold-work on the Hall–Petch breakdown in copper based micro-components |
| title_fullStr | Effect of cold-work on the Hall–Petch breakdown in copper based micro-components |
| title_full_unstemmed | Effect of cold-work on the Hall–Petch breakdown in copper based micro-components |
| title_short | Effect of cold-work on the Hall–Petch breakdown in copper based micro-components |
| title_sort | effect of cold work on the hall petch breakdown in copper based micro components |
| topic | Microforming Subgrain Microstructure Size effect Dislocation cells |
| url | https://hdl.handle.net/10356/81567 http://hdl.handle.net/10220/39595 |
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