Surface roughness effect on copper–alumina adhesion
The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With roughe...
Main Authors: | Lim, Ju Dy, Yeow, Su Yi Susan, Rhee, MinWoo Daniel, Leong, Kam Chew, Wong, Chee Cheong |
---|---|
Other Authors: | School of Materials Science & Engineering |
Format: | Journal Article |
Language: | English |
Published: |
2016
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/81601 http://hdl.handle.net/10220/39596 |
Similar Items
-
Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate
by: Lim, Ju Dy, et al.
Published: (2017) -
Intensity and contrast based surface roughness measurement approaches for rough and shiny surfaces
by: Prabhathan, P., et al.
Published: (2019) -
Experimental demonstration of Fabry-Perot open resonators in a surface-wave bandgap crystal
by: Gao, Zhen, et al.
Published: (2017) -
Thermal evaporation of copper doped tin (II) sulfide absorber thin film for solar cell application /
by: Bakhtiar Ridhwan Bachiran, 1991-, author 644481, et al.
Published: (2017) -
Copper-nanoparticle-coated fabrics for rapid and sustained antibacterial activity applications
by: Gonçalves, Rui A., et al.
Published: (2022)