Impact of field enhancement on TDDB lifetimes of Cu/Low-k test structures

Impact of field enhancement on TDDB lifetimes of Cu/Low-k test structures

Small area finger test structures were designed to isolate and study the physical failure analysis of Cu/low-k system. This paper aims to study the impact of field enhancement and area scaling through the comparison of dielectric breakdown lifetime of the finger test structures and conventional comb...

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Bibliographic Details
Main Authors:	Gan, C. L., Tan, T. L., Ong, R. X.
Other Authors:	School of Materials Science & Engineering
Format:	Conference Paper
Language:	English
Published:	2013
Online Access:	https://hdl.handle.net/10356/85259 http://hdl.handle.net/10220/12363

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