Effect of chain length on low temperature gold-gold bonding by self assembled monolayers

The tensile strength of thermocompression gold joints formed with prior surface coatings of alkanethiol self-assembled monolayers (SAMs) depends on the chain length (n) of the SAM. Enhancement of bond strength is most significant at n=6 while no improvement can be achie...

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Main Authors: Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.
Other Authors: School of Materials Science & Engineering
Format: Journal Article
Language:English
Published: 2012
Subjects:
Online Access:https://hdl.handle.net/10356/85265
http://hdl.handle.net/10220/7703
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author Ang, X. F.
Chen, Z.
Wong, Chee C.
Wei, J.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Ang, X. F.
Chen, Z.
Wong, Chee C.
Wei, J.
author_sort Ang, X. F.
collection NTU
description The tensile strength of thermocompression gold joints formed with prior surface coatings of alkanethiol self-assembled monolayers (SAMs) depends on the chain length (n) of the SAM. Enhancement of bond strength is most significant at n=6 while no improvement can be achieved using octadecanethiol (n=18). These contrasting behaviors can be interpreted as a consequence of two dominant roles of alkanethiols that govern the bonding phenomenon, namely, the passivation of gold surfaces and the ease of mechanical and/or thermal displacement.
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spelling ntu-10356/852652023-07-14T15:45:31Z Effect of chain length on low temperature gold-gold bonding by self assembled monolayers Ang, X. F. Chen, Z. Wong, Chee C. Wei, J. School of Materials Science & Engineering DRNTU::Engineering::Materials The tensile strength of thermocompression gold joints formed with prior surface coatings of alkanethiol self-assembled monolayers (SAMs) depends on the chain length (n) of the SAM. Enhancement of bond strength is most significant at n=6 while no improvement can be achieved using octadecanethiol (n=18). These contrasting behaviors can be interpreted as a consequence of two dominant roles of alkanethiols that govern the bonding phenomenon, namely, the passivation of gold surfaces and the ease of mechanical and/or thermal displacement. Published version 2012-04-10T07:24:09Z 2019-12-06T16:00:39Z 2012-04-10T07:24:09Z 2019-12-06T16:00:39Z 2008 2008 Journal Article Ang, X. F., Chen, Z., Wong, C. C., & Wei, J. (2008). Effect of Chain Length on Low Temperature Gold-Gold Bonding by Self Assembled Monolayers. Applied Physics Letters, 92(13). https://hdl.handle.net/10356/85265 http://hdl.handle.net/10220/7703 10.1063/1.2906905 en Applied physics letters © 2008 American Institute of Physics. This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of American Institute of Physics. The paper can be found at the following DOI: http://dx.doi.org/ 10.1063/1.2906905. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. 3 p. application/pdf
spellingShingle DRNTU::Engineering::Materials
Ang, X. F.
Chen, Z.
Wong, Chee C.
Wei, J.
Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
title Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
title_full Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
title_fullStr Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
title_full_unstemmed Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
title_short Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
title_sort effect of chain length on low temperature gold gold bonding by self assembled monolayers
topic DRNTU::Engineering::Materials
url https://hdl.handle.net/10356/85265
http://hdl.handle.net/10220/7703
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