Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate
The evaluation of bonding mechanisms between magnetron sputtered copper (Cu) thin films and a ceramic substrate was carried out using polycrystalline and monocrystalline alumina (Al2O3) substrates with different surface roughness. Three different bonding mechanisms, viz., surface adsorption, mechani...
| Main Authors: | , , |
|---|---|
| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2017
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/86256 http://hdl.handle.net/10220/43998 |