Novel three-dimensional carbon nanotube networks as high performance thermal interface materials
Vertically aligned carbon nanotube (VACNT) arrays are considered as promising thermal interface materials (TIMs) due to their superior out-of-plane thermal conductivities. However the air gaps between adjacent CNTs within the CNT array hinder the in-plane heat transfer, thus significantly degrading...
| Main Authors: | , , , , , , , , , , , |
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| Format: | Journal Article |
| Language: | English |
| Published: |
2018
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| Online Access: | https://hdl.handle.net/10356/87518 http://hdl.handle.net/10220/46556 |
| _version_ | 1811690989187760128 |
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| author | Kong, Qinyu Bodelot, Laurence Lebental, Bérengère Lim, Yu Dian Shiau, Li Lynn Gusarov, Boris Tan, Chong Wei Liang, Kun Lu, Congxiang Tan, Chuan Seng Tay, Beng Kang Coquet, Philippe |
| author2 | School of Electrical and Electronic Engineering |
| author_facet | School of Electrical and Electronic Engineering Kong, Qinyu Bodelot, Laurence Lebental, Bérengère Lim, Yu Dian Shiau, Li Lynn Gusarov, Boris Tan, Chong Wei Liang, Kun Lu, Congxiang Tan, Chuan Seng Tay, Beng Kang Coquet, Philippe |
| author_sort | Kong, Qinyu |
| collection | NTU |
| description | Vertically aligned carbon nanotube (VACNT) arrays are considered as promising thermal interface materials (TIMs) due to their superior out-of-plane thermal conductivities. However the air gaps between adjacent CNTs within the CNT array hinder the in-plane heat transfer, thus significantly degrading the thermal performance of VACNT-based TIMs. To improve the in-plane thermal conduction of VACNT arrays, we propose a novel three dimensional CNT (3D CNT) network structure, where VACNTs are cross-linked by randomly-oriented secondary CNTs. Three different catalyst preparation methods for the secondary CNT growth are compared in terms of their ability to produce a dense network of secondary CNTs. The 3D CNT network grown using the chemical impregnation method shows a denser network structure, and thus is chosen for further thermal characterization. The temperature fields of the corresponding 3D CNT network under different heating powers are recorded using a 15 μm-resolution infrared thermal imaging system. The in-plane thermal conductivity is then derived from these fields using numerical fitting with a 3D heat diffusion model. We find that the in-plane thermal conductivity of the 3D CNT network is 5.40 ± 0.92 W/mK, at least 30 times higher than the thermal conductivity of the primary VACNT array used to grow the 3D CNT network. |
| first_indexed | 2024-10-01T06:12:45Z |
| format | Journal Article |
| id | ntu-10356/87518 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T06:12:45Z |
| publishDate | 2018 |
| record_format | dspace |
| spelling | ntu-10356/875182020-03-07T13:57:31Z Novel three-dimensional carbon nanotube networks as high performance thermal interface materials Kong, Qinyu Bodelot, Laurence Lebental, Bérengère Lim, Yu Dian Shiau, Li Lynn Gusarov, Boris Tan, Chong Wei Liang, Kun Lu, Congxiang Tan, Chuan Seng Tay, Beng Kang Coquet, Philippe School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering 3D CNT Network In-plane Thermal Conductivity Vertically aligned carbon nanotube (VACNT) arrays are considered as promising thermal interface materials (TIMs) due to their superior out-of-plane thermal conductivities. However the air gaps between adjacent CNTs within the CNT array hinder the in-plane heat transfer, thus significantly degrading the thermal performance of VACNT-based TIMs. To improve the in-plane thermal conduction of VACNT arrays, we propose a novel three dimensional CNT (3D CNT) network structure, where VACNTs are cross-linked by randomly-oriented secondary CNTs. Three different catalyst preparation methods for the secondary CNT growth are compared in terms of their ability to produce a dense network of secondary CNTs. The 3D CNT network grown using the chemical impregnation method shows a denser network structure, and thus is chosen for further thermal characterization. The temperature fields of the corresponding 3D CNT network under different heating powers are recorded using a 15 μm-resolution infrared thermal imaging system. The in-plane thermal conductivity is then derived from these fields using numerical fitting with a 3D heat diffusion model. We find that the in-plane thermal conductivity of the 3D CNT network is 5.40 ± 0.92 W/mK, at least 30 times higher than the thermal conductivity of the primary VACNT array used to grow the 3D CNT network. MOE (Min. of Education, S’pore) Accepted version 2018-11-05T03:07:16Z 2019-12-06T16:43:36Z 2018-11-05T03:07:16Z 2019-12-06T16:43:36Z 2018 2018 Journal Article Kong, Q., Bodelot, L., Lebental, B., Lim, Y. D., Shiau, L. L., Gusarov, B., ... Tay, B. K. (2018). Novel three-dimensional carbon nanotube networks as high performance thermal interface materials. Carbon, 132359-369. doi:10.1016/j.carbon.2018.02.052 0008-6223 https://hdl.handle.net/10356/87518 http://hdl.handle.net/10220/46556 10.1016/j.carbon.2018.02.052 203700 en Carbon © 2018 Elsevier. This is the author created version of a work that has been peer reviewed and accepted for publication by Carbon, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [https://doi.org/10.1016/j.carbon.2018.02.052]. 32 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering 3D CNT Network In-plane Thermal Conductivity Kong, Qinyu Bodelot, Laurence Lebental, Bérengère Lim, Yu Dian Shiau, Li Lynn Gusarov, Boris Tan, Chong Wei Liang, Kun Lu, Congxiang Tan, Chuan Seng Tay, Beng Kang Coquet, Philippe Novel three-dimensional carbon nanotube networks as high performance thermal interface materials |
| title | Novel three-dimensional carbon nanotube networks as high performance thermal interface materials |
| title_full | Novel three-dimensional carbon nanotube networks as high performance thermal interface materials |
| title_fullStr | Novel three-dimensional carbon nanotube networks as high performance thermal interface materials |
| title_full_unstemmed | Novel three-dimensional carbon nanotube networks as high performance thermal interface materials |
| title_short | Novel three-dimensional carbon nanotube networks as high performance thermal interface materials |
| title_sort | novel three dimensional carbon nanotube networks as high performance thermal interface materials |
| topic | DRNTU::Engineering::Electrical and electronic engineering 3D CNT Network In-plane Thermal Conductivity |
| url | https://hdl.handle.net/10356/87518 http://hdl.handle.net/10220/46556 |
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