Cloud-based approach for smart product personalization

The advancement of information communication technologies(ICT) has begun to change both industrial and consumer products towards ones with attributes of smartness and servitization. Nevertheless, smart features and deep integration with smart environment tend to complicate the effort for the provisi...

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Main Authors: Jin, Xinjuan, Yu, Shiqiang, Zheng, Pai, Liu, Quan, Xu, Xun
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2018
Subjects:
Online Access:https://hdl.handle.net/10356/88801
http://hdl.handle.net/10220/45987
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author Jin, Xinjuan
Yu, Shiqiang
Zheng, Pai
Liu, Quan
Xu, Xun
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Jin, Xinjuan
Yu, Shiqiang
Zheng, Pai
Liu, Quan
Xu, Xun
author_sort Jin, Xinjuan
collection NTU
description The advancement of information communication technologies(ICT) has begun to change both industrial and consumer products towards ones with attributes of smartness and servitization. Nevertheless, smart features and deep integration with smart environment tend to complicate the effort for the provision of personalized products. To solve this problem, this paper puts forward a Smart Service Products (SSP) model comprising smart environment-enabled features and services-enabled smartness, apart from its own physical capability and functionality. A cloud-based framework for SSP personalization is proposed to enable the supply of personalized SSP with short lead-time and mass efficiency. Hence, a real case is implemented to validate the approach.
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spelling ntu-10356/888012020-03-07T14:00:31Z Cloud-based approach for smart product personalization Jin, Xinjuan Yu, Shiqiang Zheng, Pai Liu, Quan Xu, Xun School of Electrical and Electronic Engineering Delta-NTU Corporate Laboratory Communication Technology DRNTU::Engineering::Electrical and electronic engineering Information The advancement of information communication technologies(ICT) has begun to change both industrial and consumer products towards ones with attributes of smartness and servitization. Nevertheless, smart features and deep integration with smart environment tend to complicate the effort for the provision of personalized products. To solve this problem, this paper puts forward a Smart Service Products (SSP) model comprising smart environment-enabled features and services-enabled smartness, apart from its own physical capability and functionality. A cloud-based framework for SSP personalization is proposed to enable the supply of personalized SSP with short lead-time and mass efficiency. Hence, a real case is implemented to validate the approach. NRF (Natl Research Foundation, S’pore) Published version 2018-09-13T03:54:41Z 2019-12-06T17:11:08Z 2018-09-13T03:54:41Z 2019-12-06T17:11:08Z 2018 Journal Article Jin, X., Yu, S., Zheng, P., Liu, Q., & Xu, X. (2018). Cloud-based approach for smart product personalization. Procedia CIRP, 72, 922-927. doi:10.1016/j.procir.2018.03.256 2212-8271 https://hdl.handle.net/10356/88801 http://hdl.handle.net/10220/45987 10.1016/j.procir.2018.03.256 en Procedia CIRP © 2018 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/). 6 p. application/pdf
spellingShingle Communication Technology
DRNTU::Engineering::Electrical and electronic engineering
Information
Jin, Xinjuan
Yu, Shiqiang
Zheng, Pai
Liu, Quan
Xu, Xun
Cloud-based approach for smart product personalization
title Cloud-based approach for smart product personalization
title_full Cloud-based approach for smart product personalization
title_fullStr Cloud-based approach for smart product personalization
title_full_unstemmed Cloud-based approach for smart product personalization
title_short Cloud-based approach for smart product personalization
title_sort cloud based approach for smart product personalization
topic Communication Technology
DRNTU::Engineering::Electrical and electronic engineering
Information
url https://hdl.handle.net/10356/88801
http://hdl.handle.net/10220/45987
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