Novel high temperature polymeric encapsulation material for extreme environment electronics packaging

Novel high temperature polymeric encapsulation material for extreme environment electronics packaging

This study explores the usage of resorcinol based phthalonitrile (rPN) in harsh environment electronics encapsulation applications. rPN itself exhibits excellent properties as a high temperature polymeric molding compound in terms of mechanical properties and thermal stability. Its properties improv...

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Bibliographic Details
Main Authors: Phua, Eric Jian Rong, Liu, Ming, Cho, Bokun, Liu, Qing, Amini, Shahrouz, Hu, Xiao, Gan, Chee Lip
Other Authors: School of Materials Science & Engineering
Format: Journal Article
Language:English
Published: 2019
Subjects:
High Pressure
High Temperature
Engineering::Materials
Online Access:https://hdl.handle.net/10356/90058
http://hdl.handle.net/10220/49430

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