Requirement for accurate interconnect temperature measurement for electromigration test

In this work, we show accurate temperature measurement is important in electromigration (EM) test as it can affect the measured activation energy EA and current density exponent n. The deviation of measured EA and n due to the interconnect...

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Bibliographic Details
Main Authors: Hou, Yuejin, Tan, Cher Ming
Other Authors: School of Electrical and Electronic Engineering
Format: Conference Paper
Language:English
Published: 2010
Subjects:
Online Access:https://hdl.handle.net/10356/90755
http://hdl.handle.net/10220/6394
http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403696

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