The multiple temperature heater platforms for solder Electromigration test conducted at room temperature
To accommodate the increasing input-out (I/O) counts in future integrated circuits, the size of the solder bumps has to shrink and current density through each solder bump increasing. With the ever-increasing current density through the solder bumps, electromigration (EM) remains as a main concern f...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/90846 http://hdl.handle.net/10220/6382 |