A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers
This paper presents a study of a dual-mode bandpass filter integrated in a ball grid array (BGA) package for the single-chip solutions of radio frequency (RF) transceivers. The novel in-package filter, except for the economical advantage of mass production and automatic assembly, has potential benef...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2009
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/91621 http://hdl.handle.net/10220/5993 |
| _version_ | 1811679799051026432 |
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| author | Phang, T. Y. Zhang, Yue Ping Li, Xue Jun |
| author2 | School of Electrical and Electronic Engineering |
| author_facet | School of Electrical and Electronic Engineering Phang, T. Y. Zhang, Yue Ping Li, Xue Jun |
| author_sort | Phang, T. Y. |
| collection | NTU |
| description | This paper presents a study of a dual-mode bandpass filter integrated in a ball grid array (BGA) package for the single-chip solutions of radio frequency (RF) transceivers. The novel in-package filter, except for the economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured performance of the in-package filter is presented. The effects of the different physical parts of the package on the filter performance are investigated. Experimental results show that the in-package filter of size 15 X 15 X 1.905 mm3 achieved 3-dB percentage bandwidth of 14% and insertion loss of 2.07 dB at 5.25 GHz. |
| first_indexed | 2024-10-01T03:14:53Z |
| format | Journal Article |
| id | ntu-10356/91621 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T03:14:53Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | ntu-10356/916212020-03-07T14:02:41Z A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers Phang, T. Y. Zhang, Yue Ping Li, Xue Jun School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering This paper presents a study of a dual-mode bandpass filter integrated in a ball grid array (BGA) package for the single-chip solutions of radio frequency (RF) transceivers. The novel in-package filter, except for the economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured performance of the in-package filter is presented. The effects of the different physical parts of the package on the filter performance are investigated. Experimental results show that the in-package filter of size 15 X 15 X 1.905 mm3 achieved 3-dB percentage bandwidth of 14% and insertion loss of 2.07 dB at 5.25 GHz. Published version 2009-08-03T02:37:30Z 2019-12-06T18:09:06Z 2009-08-03T02:37:30Z 2019-12-06T18:09:06Z 2006 2006 Journal Article Zhang, Y. P., Li, X. J., & Phang, T. Y. (2006). A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers. IEEE Transactions on Advanced Packaging, 29(2), 354-358. 1521-3323 https://hdl.handle.net/10356/91621 http://hdl.handle.net/10220/5993 10.1109/TADVP.2006.873135 en IEEE transactions on advanced packaging IEEE Transactions on Advanced Packaging © 2006 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site. 5 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering Phang, T. Y. Zhang, Yue Ping Li, Xue Jun A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers |
| title | A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers |
| title_full | A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers |
| title_fullStr | A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers |
| title_full_unstemmed | A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers |
| title_short | A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers |
| title_sort | study of dual mode bandpass filter integrated in bga package for single chip rf transceivers |
| topic | DRNTU::Engineering::Electrical and electronic engineering |
| url | https://hdl.handle.net/10356/91621 http://hdl.handle.net/10220/5993 |
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