New salicidation technology with Ni(Pt) alloy for MOSFETs
A novel salicide technology to improve the thermal stability of the conventional Ni silicide has been developed by employing Ni(Pt) alloy salicidation. This technique provides an effective avenue to overcome the low thermal budget (<700 °C) of the conventional Ni salicidation by formi...
| Main Authors: | , , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/91823 http://hdl.handle.net/10220/8340 |
| _version_ | 1826119758562459648 |
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| author | Mangelinck, D. Chan, L. Lee, Pooi See Pey, Kin Leong Ding, Jun Chi, Dong Zhi |
| author2 | School of Materials Science & Engineering |
| author_facet | School of Materials Science & Engineering Mangelinck, D. Chan, L. Lee, Pooi See Pey, Kin Leong Ding, Jun Chi, Dong Zhi |
| author_sort | Mangelinck, D. |
| collection | NTU |
| description | A novel salicide technology to improve the thermal
stability of the conventional Ni silicide has been developed by employing
Ni(Pt) alloy salicidation. This technique provides an effective
avenue to overcome the low thermal budget (<700 °C) of
the conventional Ni salicidation by forming Ni(Pt)Si. The addition
of Pt has enhanced the thermal stability of NiSi. Improved
sheet resistance of the salicided narrow poly-Si and active lines was
achieved up to 750 °C and 700 °C for as-deposited Ni(Pt) thickness
of 30 nm and 15 nm, respectively. This successfully extends the
rapid thermal processing (RTP) windowby delaying the nucleation
of NiSi2 and agglomeration. Implementation of Ni(Pt) alloyed silicidation
was demonstrated on PMOSFETs with high drive current
and low junction leakage. |
| first_indexed | 2024-10-01T05:05:21Z |
| format | Journal Article |
| id | ntu-10356/91823 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T05:05:21Z |
| publishDate | 2012 |
| record_format | dspace |
| spelling | ntu-10356/918232023-07-14T15:50:38Z New salicidation technology with Ni(Pt) alloy for MOSFETs Mangelinck, D. Chan, L. Lee, Pooi See Pey, Kin Leong Ding, Jun Chi, Dong Zhi School of Materials Science & Engineering DRNTU::Engineering::Materials A novel salicide technology to improve the thermal stability of the conventional Ni silicide has been developed by employing Ni(Pt) alloy salicidation. This technique provides an effective avenue to overcome the low thermal budget (<700 °C) of the conventional Ni salicidation by forming Ni(Pt)Si. The addition of Pt has enhanced the thermal stability of NiSi. Improved sheet resistance of the salicided narrow poly-Si and active lines was achieved up to 750 °C and 700 °C for as-deposited Ni(Pt) thickness of 30 nm and 15 nm, respectively. This successfully extends the rapid thermal processing (RTP) windowby delaying the nucleation of NiSi2 and agglomeration. Implementation of Ni(Pt) alloyed silicidation was demonstrated on PMOSFETs with high drive current and low junction leakage. Accepted version 2012-07-26T01:48:56Z 2019-12-06T18:12:33Z 2012-07-26T01:48:56Z 2019-12-06T18:12:33Z 2001 2001 Journal Article Lee, P. S., Pey, K. L., Mangelick, D., Ding, J., Chi, D. Z., & Chan, L. (2001). New Salicidation Technology with Ni(Pt) Alloy for MOSFETs. IEEE Electron Device Letters, 22(12), 568-570. https://hdl.handle.net/10356/91823 http://hdl.handle.net/10220/8340 10.1109/55.974579 en IEEE electron device letters © 2001 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: http://dx.doi.org/10.1109/55.974579. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials Mangelinck, D. Chan, L. Lee, Pooi See Pey, Kin Leong Ding, Jun Chi, Dong Zhi New salicidation technology with Ni(Pt) alloy for MOSFETs |
| title | New salicidation technology with Ni(Pt) alloy for MOSFETs |
| title_full | New salicidation technology with Ni(Pt) alloy for MOSFETs |
| title_fullStr | New salicidation technology with Ni(Pt) alloy for MOSFETs |
| title_full_unstemmed | New salicidation technology with Ni(Pt) alloy for MOSFETs |
| title_short | New salicidation technology with Ni(Pt) alloy for MOSFETs |
| title_sort | new salicidation technology with ni pt alloy for mosfets |
| topic | DRNTU::Engineering::Materials |
| url | https://hdl.handle.net/10356/91823 http://hdl.handle.net/10220/8340 |
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