Effect of plating parameters on the intrinsic stress in electroless nickel plating
With the increasing application of electroless nickel (EN) as a bumping or under-bumping metalization material, the microelectronic packaging engineers are required to have a deeper understanding and control of intrinsic stress in EN plating. The purpose of this work is to investigate the effect of...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2012
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| Online Access: | https://hdl.handle.net/10356/94041 http://hdl.handle.net/10220/8175 |
| _version_ | 1811684817701437440 |
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| author | Chen, Zhong Xu, Xiaoda Wong, Chee C. Mhaisalkar, Subodh Gautam |
| author2 | School of Materials Science & Engineering |
| author_facet | School of Materials Science & Engineering Chen, Zhong Xu, Xiaoda Wong, Chee C. Mhaisalkar, Subodh Gautam |
| author_sort | Chen, Zhong |
| collection | NTU |
| description | With the increasing application of electroless nickel (EN) as a bumping or under-bumping metalization material, the microelectronic packaging engineers are required to have a deeper understanding and control of intrinsic stress in EN plating. The purpose of this work is to investigate the effect of some of the most important operating parameters on the formation of intrinsic stress during plating. The analysis of variances method was applied to obtain both single effects and compound effects of selected factors. Results indicate that high pH value and aged solution affect the intrinsic stress significantly, while surface roughness does not have much influence on the intrinsic stress for the range investigated. Aging at 190 °C for 170 h changes neither the Ni–P structure nor the intrinsic stress to a significant degree. Further investigation indicated that the intrinsic stress was probably related to the Ni–P microstructure as a result of the deposition rate. It was found that the higher the deposition rate, the higher the intrinsic stress. |
| first_indexed | 2024-10-01T04:34:40Z |
| format | Journal Article |
| id | ntu-10356/94041 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T04:34:40Z |
| publishDate | 2012 |
| record_format | dspace |
| spelling | ntu-10356/940412023-07-14T15:57:33Z Effect of plating parameters on the intrinsic stress in electroless nickel plating Chen, Zhong Xu, Xiaoda Wong, Chee C. Mhaisalkar, Subodh Gautam School of Materials Science & Engineering DRNTU::Engineering::Materials With the increasing application of electroless nickel (EN) as a bumping or under-bumping metalization material, the microelectronic packaging engineers are required to have a deeper understanding and control of intrinsic stress in EN plating. The purpose of this work is to investigate the effect of some of the most important operating parameters on the formation of intrinsic stress during plating. The analysis of variances method was applied to obtain both single effects and compound effects of selected factors. Results indicate that high pH value and aged solution affect the intrinsic stress significantly, while surface roughness does not have much influence on the intrinsic stress for the range investigated. Aging at 190 °C for 170 h changes neither the Ni–P structure nor the intrinsic stress to a significant degree. Further investigation indicated that the intrinsic stress was probably related to the Ni–P microstructure as a result of the deposition rate. It was found that the higher the deposition rate, the higher the intrinsic stress. Accepted version 2012-05-29T08:03:12Z 2019-12-06T18:49:46Z 2012-05-29T08:03:12Z 2019-12-06T18:49:46Z 2003 2003 Journal Article Chen, Z., Xu, X., Wong, C. C., & Mhaisalkar, S. G. (2003). Effect of plating parameters on the intrinsic stress in electroless nickel plating. Surface and coatings technology, 167(2-3), 170-176. https://hdl.handle.net/10356/94041 http://hdl.handle.net/10220/8175 10.1016/S0257-8972(02)00911-8 en Surface and coatings technology © 2003 Elsevier.This is the author created version of a work that has been peer reviewed and accepted for publication by Surface and Coatings Technology, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/S0257-8972(02)00911-8]. 26 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials Chen, Zhong Xu, Xiaoda Wong, Chee C. Mhaisalkar, Subodh Gautam Effect of plating parameters on the intrinsic stress in electroless nickel plating |
| title | Effect of plating parameters on the intrinsic stress in electroless nickel plating |
| title_full | Effect of plating parameters on the intrinsic stress in electroless nickel plating |
| title_fullStr | Effect of plating parameters on the intrinsic stress in electroless nickel plating |
| title_full_unstemmed | Effect of plating parameters on the intrinsic stress in electroless nickel plating |
| title_short | Effect of plating parameters on the intrinsic stress in electroless nickel plating |
| title_sort | effect of plating parameters on the intrinsic stress in electroless nickel plating |
| topic | DRNTU::Engineering::Materials |
| url | https://hdl.handle.net/10356/94041 http://hdl.handle.net/10220/8175 |
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