Applications of multi-walled carbon nanotube in electronic packaging
Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them,...
| Main Authors: | , , , |
|---|---|
| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2013
|
| Online Access: | https://hdl.handle.net/10356/95120 http://hdl.handle.net/10220/9225 |
| _version_ | 1826111471259484160 |
|---|---|
| author | Tan, Cher Ming Baudot, Jacques Desire Charles Han, Yongdian Jing, Hongyang |
| author2 | School of Electrical and Electronic Engineering |
| author_facet | School of Electrical and Electronic Engineering Tan, Cher Ming Baudot, Jacques Desire Charles Han, Yongdian Jing, Hongyang |
| author_sort | Tan, Cher Ming |
| collection | NTU |
| description | Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work. |
| first_indexed | 2024-10-01T02:51:16Z |
| format | Journal Article |
| id | ntu-10356/95120 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T02:51:16Z |
| publishDate | 2013 |
| record_format | dspace |
| spelling | ntu-10356/951202022-02-16T16:27:30Z Applications of multi-walled carbon nanotube in electronic packaging Tan, Cher Ming Baudot, Jacques Desire Charles Han, Yongdian Jing, Hongyang School of Electrical and Electronic Engineering Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work. Published version 2013-02-25T01:13:08Z 2019-12-06T19:08:37Z 2013-02-25T01:13:08Z 2019-12-06T19:08:37Z 2012 2012 Journal Article Tan, C. M., Baudot, J. D. C., Han, Y., & Jing, H. (2012). Applications of multi-walled carbon nanotube in electronic packaging. Nanoscale Research Letters, 7(1), 183. 1556-276X https://hdl.handle.net/10356/95120 http://hdl.handle.net/10220/9225 10.1186/1556-276X-7-183 22405035 en Nanoscale Research Letters © 2012 The Authors. application/pdf |
| spellingShingle | Tan, Cher Ming Baudot, Jacques Desire Charles Han, Yongdian Jing, Hongyang Applications of multi-walled carbon nanotube in electronic packaging |
| title | Applications of multi-walled carbon nanotube in electronic packaging |
| title_full | Applications of multi-walled carbon nanotube in electronic packaging |
| title_fullStr | Applications of multi-walled carbon nanotube in electronic packaging |
| title_full_unstemmed | Applications of multi-walled carbon nanotube in electronic packaging |
| title_short | Applications of multi-walled carbon nanotube in electronic packaging |
| title_sort | applications of multi walled carbon nanotube in electronic packaging |
| url | https://hdl.handle.net/10356/95120 http://hdl.handle.net/10220/9225 |
| work_keys_str_mv | AT tancherming applicationsofmultiwalledcarbonnanotubeinelectronicpackaging AT baudotjacquesdesirecharles applicationsofmultiwalledcarbonnanotubeinelectronicpackaging AT hanyongdian applicationsofmultiwalledcarbonnanotubeinelectronicpackaging AT jinghongyang applicationsofmultiwalledcarbonnanotubeinelectronicpackaging |