On thermo-mechanical reliability of plated-through-hole (PTH)
The mechanical properties of plated copper in plated-through-hole (PTH) were investigated experimentally by a thermo-mechanical analyzer, a nano-indenter, and an acoustic emission instrument. Coefficients of fatigue life prediction models for plated copper have been determined by different failure c...
| Main Authors: | , , , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/95160 http://hdl.handle.net/10220/11117 |
| _version_ | 1826119148353093632 |
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| author | Shao, Jiang Xie, Cunyi Zhang, Zheng Su, Fei Mao, Ronghai Xiong, Ji Zhou, Kun |
| author2 | School of Mechanical and Aerospace Engineering |
| author_facet | School of Mechanical and Aerospace Engineering Shao, Jiang Xie, Cunyi Zhang, Zheng Su, Fei Mao, Ronghai Xiong, Ji Zhou, Kun |
| author_sort | Shao, Jiang |
| collection | NTU |
| description | The mechanical properties of plated copper in plated-through-hole (PTH) were investigated experimentally by a thermo-mechanical analyzer, a nano-indenter, and an acoustic emission instrument. Coefficients of fatigue life prediction models for plated copper have been determined by different failure criteria. Afterwards thermal fatigue test of PTH at three different diameters were performed, and Weibull statistics was employed to evaluate the fatigue life of samples under different failure criteria. Finally, the strain variation of PTH during thermal cycle has been simulated by the finite element analysis (FEA) so as to predict its fatigue life by the selected models. From the comparison of the estimated fatigue life and its experimental results, it is found that the error can be minimized to be within 100%, provided that the drifting of electrical resistance by 20% is used as failure criteria and total strain amplitude is used as control variable in fatigue life prediction model. Based on these findings, design of PTH in printed circuit board (PCB) can be optimized by FEA. It is concluded that fatigue life of PTH will increase with lesser PCB layers, smaller depth-to-diameter ratio, higher PTH density and thicker plated copper. |
| first_indexed | 2024-10-01T04:55:21Z |
| format | Journal Article |
| id | ntu-10356/95160 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T04:55:21Z |
| publishDate | 2013 |
| record_format | dspace |
| spelling | ntu-10356/951602020-03-07T13:22:16Z On thermo-mechanical reliability of plated-through-hole (PTH) Shao, Jiang Xie, Cunyi Zhang, Zheng Su, Fei Mao, Ronghai Xiong, Ji Zhou, Kun School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering The mechanical properties of plated copper in plated-through-hole (PTH) were investigated experimentally by a thermo-mechanical analyzer, a nano-indenter, and an acoustic emission instrument. Coefficients of fatigue life prediction models for plated copper have been determined by different failure criteria. Afterwards thermal fatigue test of PTH at three different diameters were performed, and Weibull statistics was employed to evaluate the fatigue life of samples under different failure criteria. Finally, the strain variation of PTH during thermal cycle has been simulated by the finite element analysis (FEA) so as to predict its fatigue life by the selected models. From the comparison of the estimated fatigue life and its experimental results, it is found that the error can be minimized to be within 100%, provided that the drifting of electrical resistance by 20% is used as failure criteria and total strain amplitude is used as control variable in fatigue life prediction model. Based on these findings, design of PTH in printed circuit board (PCB) can be optimized by FEA. It is concluded that fatigue life of PTH will increase with lesser PCB layers, smaller depth-to-diameter ratio, higher PTH density and thicker plated copper. 2013-07-10T07:13:22Z 2019-12-06T19:09:21Z 2013-07-10T07:13:22Z 2019-12-06T19:09:21Z 2011 2011 Journal Article https://hdl.handle.net/10356/95160 http://hdl.handle.net/10220/11117 10.1016/j.microrel.2011.11.021 en Microelectronics reliability © 2011 Elsevier Ltd. |
| spellingShingle | DRNTU::Engineering::Mechanical engineering Shao, Jiang Xie, Cunyi Zhang, Zheng Su, Fei Mao, Ronghai Xiong, Ji Zhou, Kun On thermo-mechanical reliability of plated-through-hole (PTH) |
| title | On thermo-mechanical reliability of plated-through-hole (PTH) |
| title_full | On thermo-mechanical reliability of plated-through-hole (PTH) |
| title_fullStr | On thermo-mechanical reliability of plated-through-hole (PTH) |
| title_full_unstemmed | On thermo-mechanical reliability of plated-through-hole (PTH) |
| title_short | On thermo-mechanical reliability of plated-through-hole (PTH) |
| title_sort | on thermo mechanical reliability of plated through hole pth |
| topic | DRNTU::Engineering::Mechanical engineering |
| url | https://hdl.handle.net/10356/95160 http://hdl.handle.net/10220/11117 |
| work_keys_str_mv | AT shaojiang onthermomechanicalreliabilityofplatedthroughholepth AT xiecunyi onthermomechanicalreliabilityofplatedthroughholepth AT zhangzheng onthermomechanicalreliabilityofplatedthroughholepth AT sufei onthermomechanicalreliabilityofplatedthroughholepth AT maoronghai onthermomechanicalreliabilityofplatedthroughholepth AT xiongji onthermomechanicalreliabilityofplatedthroughholepth AT zhoukun onthermomechanicalreliabilityofplatedthroughholepth |