A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads
The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm...
| Main Authors: | , , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/95669 http://hdl.handle.net/10220/8243 |
| _version_ | 1811684964466425856 |
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| author | Xu, Hui Liu, Changqing Silberschmidt, Vadim V. Pramana, S. S. White, Timothy John Chen, Z. |
| author2 | School of Materials Science & Engineering |
| author_facet | School of Materials Science & Engineering Xu, Hui Liu, Changqing Silberschmidt, Vadim V. Pramana, S. S. White, Timothy John Chen, Z. |
| author_sort | Xu, Hui |
| collection | NTU |
| description | The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm thick). Where oxides persisted, an amorphous aluminium oxide layer connected with a crystalline copper oxide. It was estimated that ultrasonic vibration caused an effective local temperature increase to 465 °C that accelerated interdiffusion and enhanced the formation of Cu–Al intermetallics. |
| first_indexed | 2024-10-01T04:37:00Z |
| format | Journal Article |
| id | ntu-10356/95669 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T04:37:00Z |
| publishDate | 2012 |
| record_format | dspace |
| spelling | ntu-10356/956692023-07-14T15:53:58Z A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads Xu, Hui Liu, Changqing Silberschmidt, Vadim V. Pramana, S. S. White, Timothy John Chen, Z. School of Materials Science & Engineering DRNTU::Engineering::Materials The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm thick). Where oxides persisted, an amorphous aluminium oxide layer connected with a crystalline copper oxide. It was estimated that ultrasonic vibration caused an effective local temperature increase to 465 °C that accelerated interdiffusion and enhanced the formation of Cu–Al intermetallics. Accepted version 2012-06-27T03:32:36Z 2019-12-06T19:19:29Z 2012-06-27T03:32:36Z 2019-12-06T19:19:29Z 2009 2009 Journal Article Xu, H., Liu, C., Silberschmidt, V. V.,Pramana, S. S., White, T. J., & Chen, Z. (2009). A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads. Scripta Materialia, 61(2), 165-168. 1359-6462 https://hdl.handle.net/10356/95669 http://hdl.handle.net/10220/8243 10.1016/j.scriptamat.2009.03.034 en Scripta materialia © 2009 Acta Materialia Inc. This is the author created version of a work that has been peer reviewed and accepted for publication in Scripta Materialia, published by Elsevier on behalf of Acta Materialia Inc. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.scriptamat.2009.03.034]. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials Xu, Hui Liu, Changqing Silberschmidt, Vadim V. Pramana, S. S. White, Timothy John Chen, Z. A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads |
| title | A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads |
| title_full | A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads |
| title_fullStr | A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads |
| title_full_unstemmed | A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads |
| title_short | A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads |
| title_sort | re examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads |
| topic | DRNTU::Engineering::Materials |
| url | https://hdl.handle.net/10356/95669 http://hdl.handle.net/10220/8243 |
| work_keys_str_mv | AT xuhui areexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads AT liuchangqing areexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads AT silberschmidtvadimv areexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads AT pramanass areexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads AT whitetimothyjohn areexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads AT chenz areexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads AT xuhui reexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads AT liuchangqing reexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads AT silberschmidtvadimv reexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads AT pramanass reexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads AT whitetimothyjohn reexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads AT chenz reexaminationofthemechanismofthermosoniccopperballbondingonaluminiummetallizationpads |