Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints
In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn-Ag-Cu (SAC) solder matrix, to form composite solder. Up to 0.05% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au-finished Cu su...
Main Authors: | Nai, S. M. L., Xu, L. Y., Wei, J., Jing, Hongyang, Tan, Cher Ming, Han, Yongdian |
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Other Authors: | School of Electrical and Electronic Engineering |
Format: | Journal Article |
Language: | English |
Published: |
2013
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/96171 http://hdl.handle.net/10220/18065 |
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