Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability
Low-temperature wafer-level Cu-to-Cu thermo-compression bonding and its reliability for hermetic sealing application have been investigated in this work. The volume of the encapsulated cavities is about 1.4×10−3 cm3 in accordance with the MIL-STD-883E standard prescribed for microelectronics packagi...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/96231 http://hdl.handle.net/10220/11485 |