Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model

Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model

3D physical design needs accurate device model of through-silicon vias (TSVs). In this paper, physics-based electrical-thermal model is introduced for both signal and dummy thermal TSVs with the consideration of nonlinear electrical-thermal dependence. Taking thermal-reliable 3D clock-tree synthesis...

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Bibliographic Details
Main Authors: Shang, Yang, Zhang, Chun, Yu, Hao, Tan, Chuan Seng, Zhao, Xin, Lim, Sung Kyu
Other Authors: School of Electrical and Electronic Engineering
Format: Conference Paper
Language:English
Published: 2013
Subjects:
DRNTU::Engineering::Electrical and electronic engineering
Online Access:https://hdl.handle.net/10356/96541
http://hdl.handle.net/10220/17271

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