Copper nanoparticles embedded in a polyimide film for non-volatile memory applications
The charge storage and retention characteristics of a nanoparticle-laden thin polyimide film were investigated for application in non-volatile memory devices. Well-dispersed and uniform sized metallic copper nanoparticles (CuNPs) were formed as embedded entities within the confines of polyimide film...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2013
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| Online Access: | https://hdl.handle.net/10356/96570 http://hdl.handle.net/10220/17270 |
| _version_ | 1824455834086670336 |
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| author | Gupta, Raju Kumar Kusuma, Damar Yoga Lee, P. S. Srinivasan, M. P. |
| author2 | School of Materials Science & Engineering |
| author_facet | School of Materials Science & Engineering Gupta, Raju Kumar Kusuma, Damar Yoga Lee, P. S. Srinivasan, M. P. |
| author_sort | Gupta, Raju Kumar |
| collection | NTU |
| description | The charge storage and retention characteristics of a nanoparticle-laden thin polyimide film were investigated for application in non-volatile memory devices. Well-dispersed and uniform sized metallic copper nanoparticles (CuNPs) were formed as embedded entities within the confines of polyimide film that was cast from solution. The nanoparticle-containing films were characterized by X-ray photoelectron spectroscopy, atomic force and scanning electron microscopies. Capacitance–voltage measurements showed that the embedded CuNPs functioned as a floating gate in metal–insulator–semiconductor-type capacitor and exhibited a large hysteresis window of 1.52 V. C–t measurements conducted after applying a charging bias of 5 V showed that the charge was retained beyond 20,000 s. The technique holds promise for developing low-cost processes for memory devices that employ relatively inexpensive materials, and yet demonstrate very good performance. |
| first_indexed | 2025-02-19T03:44:30Z |
| format | Journal Article |
| id | ntu-10356/96570 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2025-02-19T03:44:30Z |
| publishDate | 2013 |
| record_format | dspace |
| spelling | ntu-10356/965702020-06-01T10:01:44Z Copper nanoparticles embedded in a polyimide film for non-volatile memory applications Gupta, Raju Kumar Kusuma, Damar Yoga Lee, P. S. Srinivasan, M. P. School of Materials Science & Engineering DRNTU::Engineering::Materials The charge storage and retention characteristics of a nanoparticle-laden thin polyimide film were investigated for application in non-volatile memory devices. Well-dispersed and uniform sized metallic copper nanoparticles (CuNPs) were formed as embedded entities within the confines of polyimide film that was cast from solution. The nanoparticle-containing films were characterized by X-ray photoelectron spectroscopy, atomic force and scanning electron microscopies. Capacitance–voltage measurements showed that the embedded CuNPs functioned as a floating gate in metal–insulator–semiconductor-type capacitor and exhibited a large hysteresis window of 1.52 V. C–t measurements conducted after applying a charging bias of 5 V showed that the charge was retained beyond 20,000 s. The technique holds promise for developing low-cost processes for memory devices that employ relatively inexpensive materials, and yet demonstrate very good performance. 2013-11-05T05:46:40Z 2019-12-06T19:32:39Z 2013-11-05T05:46:40Z 2019-12-06T19:32:39Z 2011 2011 Journal Article Gupta, R. K., Kusuma, D. Y., Lee, P. S., & Srinivasan, M. P. (2011). Copper nanoparticles embedded in a polyimide film for non-volatile memory applications. Materials letters, 68, 287-289. 0167-577X https://hdl.handle.net/10356/96570 http://hdl.handle.net/10220/17270 10.1016/j.matlet.2011.10.099 en Materials letters |
| spellingShingle | DRNTU::Engineering::Materials Gupta, Raju Kumar Kusuma, Damar Yoga Lee, P. S. Srinivasan, M. P. Copper nanoparticles embedded in a polyimide film for non-volatile memory applications |
| title | Copper nanoparticles embedded in a polyimide film for non-volatile memory applications |
| title_full | Copper nanoparticles embedded in a polyimide film for non-volatile memory applications |
| title_fullStr | Copper nanoparticles embedded in a polyimide film for non-volatile memory applications |
| title_full_unstemmed | Copper nanoparticles embedded in a polyimide film for non-volatile memory applications |
| title_short | Copper nanoparticles embedded in a polyimide film for non-volatile memory applications |
| title_sort | copper nanoparticles embedded in a polyimide film for non volatile memory applications |
| topic | DRNTU::Engineering::Materials |
| url | https://hdl.handle.net/10356/96570 http://hdl.handle.net/10220/17270 |
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