Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits
An analytical model is proposed which relates the bonding temperature, pressure and duration with the integrity of metal–metal thermocompressionbonds. Unlike previous models, this approach takes into account the pressure-dependent time evolution of the thermocompressionbond formation. The model allo...
| Main Authors: | , , , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/96939 http://hdl.handle.net/10220/8174 |