Analysis of laterally non-uniform layers and sub-micron devices by Rutherford backscattering spectrometry

A method for analyzing sub-micron devices by Rutherford backscattering spectrometry is presented. Using simplifying assumptions, we are able to simulate the backscattering spectrum of laterally non-uniform samples. The method has been verified with Ni/Pt laterally non-uniform layers on (1 0 0)Si sub...

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Main Authors: Pey, Kin Leong, Lee, Pooi See, Mangelinck, D., Osipowitcz, T.
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/97163
http://hdl.handle.net/10220/10518
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author Pey, Kin Leong
Lee, Pooi See
Mangelinck, D.
Osipowitcz, T.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Pey, Kin Leong
Lee, Pooi See
Mangelinck, D.
Osipowitcz, T.
author_sort Pey, Kin Leong
collection NTU
description A method for analyzing sub-micron devices by Rutherford backscattering spectrometry is presented. Using simplifying assumptions, we are able to simulate the backscattering spectrum of laterally non-uniform samples. The method has been verified with Ni/Pt laterally non-uniform layers on (1 0 0)Si substrate and has been applied to characterize the formation of Ni silicide in structures similar to metal oxide semiconductor (MOS) transistors. It is shown that the analysis of devices with a linewidth as low as 0.25 μm is possible using micro RBS and the method of simulation that we have developed.
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spelling ntu-10356/971632020-06-01T10:01:32Z Analysis of laterally non-uniform layers and sub-micron devices by Rutherford backscattering spectrometry Pey, Kin Leong Lee, Pooi See Mangelinck, D. Osipowitcz, T. School of Electrical and Electronic Engineering School of Materials Science & Engineering DRNTU::Engineering::Materials A method for analyzing sub-micron devices by Rutherford backscattering spectrometry is presented. Using simplifying assumptions, we are able to simulate the backscattering spectrum of laterally non-uniform samples. The method has been verified with Ni/Pt laterally non-uniform layers on (1 0 0)Si substrate and has been applied to characterize the formation of Ni silicide in structures similar to metal oxide semiconductor (MOS) transistors. It is shown that the analysis of devices with a linewidth as low as 0.25 μm is possible using micro RBS and the method of simulation that we have developed. 2013-06-21T02:55:16Z 2019-12-06T19:39:33Z 2013-06-21T02:55:16Z 2019-12-06T19:39:33Z 2003 2003 Journal Article Mangelinck, D., Lee, P. S., Osipowitcz, T., & Pey, K. L. (2004). Analysis of laterally non-uniform layers and sub-micron devices by Rutherford backscattering spectrometry. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 215(3-4), 495-500. 0168-583X https://hdl.handle.net/10356/97163 http://hdl.handle.net/10220/10518 10.1016/j.nimb.2003.08.040 en Nuclear instruments and methods in Physics research Section B: beam interactions with materials and atoms © 2003 Elsevier B.V.
spellingShingle DRNTU::Engineering::Materials
Pey, Kin Leong
Lee, Pooi See
Mangelinck, D.
Osipowitcz, T.
Analysis of laterally non-uniform layers and sub-micron devices by Rutherford backscattering spectrometry
title Analysis of laterally non-uniform layers and sub-micron devices by Rutherford backscattering spectrometry
title_full Analysis of laterally non-uniform layers and sub-micron devices by Rutherford backscattering spectrometry
title_fullStr Analysis of laterally non-uniform layers and sub-micron devices by Rutherford backscattering spectrometry
title_full_unstemmed Analysis of laterally non-uniform layers and sub-micron devices by Rutherford backscattering spectrometry
title_short Analysis of laterally non-uniform layers and sub-micron devices by Rutherford backscattering spectrometry
title_sort analysis of laterally non uniform layers and sub micron devices by rutherford backscattering spectrometry
topic DRNTU::Engineering::Materials
url https://hdl.handle.net/10356/97163
http://hdl.handle.net/10220/10518
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