Thermal conductivity of titanium aluminum silicon nitride coatings deposited by lateral rotating cathode arc
A series of physical vapour deposition titanium aluminum silicon nitride nanocomposite coating with a different (Al + Si)/Ti atomic ratio, with a thickness of around 2.5 μm were deposited on stainless steel substrate by a lateral rotating cathode arc process in a flowing nitrogen atmosphere. The com...
| Main Authors: | , , , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
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2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/98732 http://hdl.handle.net/10220/17477 |
| _version_ | 1824454754852405248 |
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| author | Ding, X. Z. Cheong, J. Y. Samani, M. K. Amini, Shahrouz Khosravian, Narjes Tay, Beng Kang Chen, Gang |
| author2 | School of Electrical and Electronic Engineering |
| author_facet | School of Electrical and Electronic Engineering Ding, X. Z. Cheong, J. Y. Samani, M. K. Amini, Shahrouz Khosravian, Narjes Tay, Beng Kang Chen, Gang |
| author_sort | Ding, X. Z. |
| collection | NTU |
| description | A series of physical vapour deposition titanium aluminum silicon nitride nanocomposite coating with a different (Al + Si)/Ti atomic ratio, with a thickness of around 2.5 μm were deposited on stainless steel substrate by a lateral rotating cathode arc process in a flowing nitrogen atmosphere. The composition and microstructure of the as-deposited coatings were analyzed by energy dispersive X-ray spectroscopy, and X-ray diffraction, and cross-sectional scanning electron microscopy observation. The titanium nitride (TiN) coating shows a clear columnar structure with a predominant (111) preferential orientation. With the incorporation of Al and Si, the crystallite size in the coatings decreased gradually, and the columnar structure and (111) preferred orientation disappeared. Thermal conductivity of the as-deposited coating samples at room temperature was measured by using pulsed photothermal reflectance technique. Thermal conductivity of the pure TiN coating is about 11.9 W/mK. With increasing the (Al + Si)/Ti atomic ratio, the coatings' thermal conductivity decreased monotonously. This reduction of thermal conductivity could be ascribed to the variation of coatings' microstructure, including the decrease of grain size and the resultant increase of grain boundaries, the disruption of columnar structure, and the reduced preferential orientation. |
| first_indexed | 2025-02-19T03:27:21Z |
| format | Journal Article |
| id | ntu-10356/98732 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2025-02-19T03:27:21Z |
| publishDate | 2013 |
| record_format | dspace |
| spelling | ntu-10356/987322020-06-01T10:26:40Z Thermal conductivity of titanium aluminum silicon nitride coatings deposited by lateral rotating cathode arc Ding, X. Z. Cheong, J. Y. Samani, M. K. Amini, Shahrouz Khosravian, Narjes Tay, Beng Kang Chen, Gang School of Electrical and Electronic Engineering School of Materials Science & Engineering A*STAR SIMTech Research Techno Plaza DRNTU::Engineering::Materials A series of physical vapour deposition titanium aluminum silicon nitride nanocomposite coating with a different (Al + Si)/Ti atomic ratio, with a thickness of around 2.5 μm were deposited on stainless steel substrate by a lateral rotating cathode arc process in a flowing nitrogen atmosphere. The composition and microstructure of the as-deposited coatings were analyzed by energy dispersive X-ray spectroscopy, and X-ray diffraction, and cross-sectional scanning electron microscopy observation. The titanium nitride (TiN) coating shows a clear columnar structure with a predominant (111) preferential orientation. With the incorporation of Al and Si, the crystallite size in the coatings decreased gradually, and the columnar structure and (111) preferred orientation disappeared. Thermal conductivity of the as-deposited coating samples at room temperature was measured by using pulsed photothermal reflectance technique. Thermal conductivity of the pure TiN coating is about 11.9 W/mK. With increasing the (Al + Si)/Ti atomic ratio, the coatings' thermal conductivity decreased monotonously. This reduction of thermal conductivity could be ascribed to the variation of coatings' microstructure, including the decrease of grain size and the resultant increase of grain boundaries, the disruption of columnar structure, and the reduced preferential orientation. 2013-11-08T06:17:42Z 2019-12-06T19:58:58Z 2013-11-08T06:17:42Z 2019-12-06T19:58:58Z 2013 2013 Journal Article Samani, M., Ding, X., Amini, S., Khosravian, N., Cheong, J., Chen, G., et al. (2013). Thermal conductivity of titanium aluminum silicon nitride coatings deposited by lateral rotating cathode arc. Thin solid films, 537, 108-112. 0040-6090 https://hdl.handle.net/10356/98732 http://hdl.handle.net/10220/17477 10.1016/j.tsf.2013.04.029 en Thin solid films |
| spellingShingle | DRNTU::Engineering::Materials Ding, X. Z. Cheong, J. Y. Samani, M. K. Amini, Shahrouz Khosravian, Narjes Tay, Beng Kang Chen, Gang Thermal conductivity of titanium aluminum silicon nitride coatings deposited by lateral rotating cathode arc |
| title | Thermal conductivity of titanium aluminum silicon nitride coatings deposited by lateral rotating cathode arc |
| title_full | Thermal conductivity of titanium aluminum silicon nitride coatings deposited by lateral rotating cathode arc |
| title_fullStr | Thermal conductivity of titanium aluminum silicon nitride coatings deposited by lateral rotating cathode arc |
| title_full_unstemmed | Thermal conductivity of titanium aluminum silicon nitride coatings deposited by lateral rotating cathode arc |
| title_short | Thermal conductivity of titanium aluminum silicon nitride coatings deposited by lateral rotating cathode arc |
| title_sort | thermal conductivity of titanium aluminum silicon nitride coatings deposited by lateral rotating cathode arc |
| topic | DRNTU::Engineering::Materials |
| url | https://hdl.handle.net/10356/98732 http://hdl.handle.net/10220/17477 |
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