Carbon based multi-functional materials towards 3D system integration : application to thermal and interconnect management
In order to meet the demands of increasing package density and miniaturization of devices without compromising performance, the most challenging issues to tackle are thermal and interconnect management. In this paper, we will first understand the interfacial transport between Si and Carbon for bette...
| Main Authors: | , , , , , , , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/98763 http://hdl.handle.net/10220/13451 |