Comparison of electromigration simulation in test structure and actual circuit
With the rapid increase in circuit complexity, accurate reliability simulator is necessary as reliability testing for fabricated circuit is progressively more time and resource consuming. Simple 2D electromigration (EM) simulator has many limitations and most of the 3D EM simulations in the literatu...
Main Authors: | He, Feifei, Tan, Cher Ming |
---|---|
Other Authors: | School of Electrical and Electronic Engineering |
Format: | Journal Article |
Language: | English |
Published: |
2013
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/98921 http://hdl.handle.net/10220/12570 |
Similar Items
-
Electromigration reliability of interconnections in RF low noise amplifier circuit
by: He, Feifei, et al.
Published: (2013) -
3D electromigration modeling at the circuit layout level
by: He, Feifei
Published: (2012) -
Requirement for accurate interconnect temperature measurement for electromigration test
by: Hou, Yuejin, et al.
Published: (2010) -
Application of Wigner–Ville distribution in electromigration noise analysis
by: Tan, Cher Ming, et al.
Published: (2009) -
The multiple temperature heater platforms for solder Electromigration test conducted at room temperature
by: Hou, Yuejin, et al.
Published: (2010)