Distributed thermal-aware task scheduling for 3D network-on-chip
The development of 3D integration technology significantly improves the bandwidth of network-on-chip (NoC) system. However, the 3D technology-enabled high integration density also brings severe concerns of temperature increase, which may impair system reliability and degrade the performance. Task sc...
| Main Authors: | , , |
|---|---|
| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2013
|
| Online Access: | https://hdl.handle.net/10356/99911 http://hdl.handle.net/10220/12967 |
| _version_ | 1826110003950387200 |
|---|---|
| author | Cui, Yingnan Zhang, Wei Yu, Hao |
| author2 | School of Computer Engineering |
| author_facet | School of Computer Engineering Cui, Yingnan Zhang, Wei Yu, Hao |
| author_sort | Cui, Yingnan |
| collection | NTU |
| description | The development of 3D integration technology significantly improves the bandwidth of network-on-chip (NoC) system. However, the 3D technology-enabled high integration density also brings severe concerns of temperature increase, which may impair system reliability and degrade the performance. Task scheduling has been regarded as one effective approach in eliminating thermal hotspot without introducing hardware overhead. However, centralized thermal-aware task scheduling algorithms for 3D-NoC have been limited for incurring high computational complexity as the system scale increase. In this paper, we propose a distributed agent-based thermal-aware task scheduling algorithm for 3D-NoC which shows high scheduling efficiency and high scalability. Experimental results have shown that when compared to the centralized algorithms, our algorithm can achieve up to 13 °C reduction in peak temperature of the system without sacrificing performance. |
| first_indexed | 2024-10-01T02:27:41Z |
| format | Conference Paper |
| id | ntu-10356/99911 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T02:27:41Z |
| publishDate | 2013 |
| record_format | dspace |
| spelling | ntu-10356/999112020-05-28T07:17:32Z Distributed thermal-aware task scheduling for 3D network-on-chip Cui, Yingnan Zhang, Wei Yu, Hao School of Computer Engineering School of Electrical and Electronic Engineering IEEE International Conference on Computer Design (30th : 2012 : Montreal, Canada) The development of 3D integration technology significantly improves the bandwidth of network-on-chip (NoC) system. However, the 3D technology-enabled high integration density also brings severe concerns of temperature increase, which may impair system reliability and degrade the performance. Task scheduling has been regarded as one effective approach in eliminating thermal hotspot without introducing hardware overhead. However, centralized thermal-aware task scheduling algorithms for 3D-NoC have been limited for incurring high computational complexity as the system scale increase. In this paper, we propose a distributed agent-based thermal-aware task scheduling algorithm for 3D-NoC which shows high scheduling efficiency and high scalability. Experimental results have shown that when compared to the centralized algorithms, our algorithm can achieve up to 13 °C reduction in peak temperature of the system without sacrificing performance. Accepted version 2013-08-05T02:49:46Z 2019-12-06T20:13:28Z 2013-08-05T02:49:46Z 2019-12-06T20:13:28Z 2012 2012 Conference Paper Cui, Y., Zhang, W., & Yu, H. (2012). Distributed thermal-aware task scheduling for 3D network-on-chip. 2012 IEEE 30th International Conference on Computer Design (ICCD 2012), 494-495. https://hdl.handle.net/10356/99911 http://hdl.handle.net/10220/12967 10.1109/ICCD.2012.6378690 en © 2012 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: [http://dx.doi.org/10.1109/ICCD.2012.6378690]. application/pdf |
| spellingShingle | Cui, Yingnan Zhang, Wei Yu, Hao Distributed thermal-aware task scheduling for 3D network-on-chip |
| title | Distributed thermal-aware task scheduling for 3D network-on-chip |
| title_full | Distributed thermal-aware task scheduling for 3D network-on-chip |
| title_fullStr | Distributed thermal-aware task scheduling for 3D network-on-chip |
| title_full_unstemmed | Distributed thermal-aware task scheduling for 3D network-on-chip |
| title_short | Distributed thermal-aware task scheduling for 3D network-on-chip |
| title_sort | distributed thermal aware task scheduling for 3d network on chip |
| url | https://hdl.handle.net/10356/99911 http://hdl.handle.net/10220/12967 |
| work_keys_str_mv | AT cuiyingnan distributedthermalawaretaskschedulingfor3dnetworkonchip AT zhangwei distributedthermalawaretaskschedulingfor3dnetworkonchip AT yuhao distributedthermalawaretaskschedulingfor3dnetworkonchip |