Distributed thermal-aware task scheduling for 3D network-on-chip
The development of 3D integration technology significantly improves the bandwidth of network-on-chip (NoC) system. However, the 3D technology-enabled high integration density also brings severe concerns of temperature increase, which may impair system reliability and degrade the performance. Task sc...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2013
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| Online Access: | https://hdl.handle.net/10356/99911 http://hdl.handle.net/10220/12967 |