Development of an economical lapping process
The manufacturing of silicon wafers in particular involves numerous processes such as grinding, lapping, and polishing of large diameter wafers employing expensive equipment in order to produce the required optical quality and damage-free surfaces. In the finishing of thin silicon chips for making I...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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Trans Tech Publications, Switzerland
2012
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/28463/2/DEVELOPMENT_OF_AN_ECONOMICAL_LAPPING_PROCESS.pdf |
| _version_ | 1825647096530731008 |
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| author | Konneh, Mohamed Tamsir, Afzeri Triblas Adesta, Erry Yulian |
| author_facet | Konneh, Mohamed Tamsir, Afzeri Triblas Adesta, Erry Yulian |
| author_sort | Konneh, Mohamed |
| collection | IIUM |
| description | The manufacturing of silicon wafers in particular involves numerous processes such as grinding, lapping, and polishing of large diameter wafers employing expensive equipment in order to produce the required optical quality and damage-free surfaces. In the finishing of thin silicon chips for making IC chips especially, it is difficult to lap and polish the substrate and obtain low surface integrity, surface finish and at the same time generate flat planar surfaces. This paper presents the development of a low cost lapping process, the process tried out on thin silicon chips
that generated fracture-free with mirror-like surfaces of low roughness values and reasonably high degree of flatness. |
| first_indexed | 2024-03-05T23:12:33Z |
| format | Article |
| id | oai:generic.eprints.org:28463 |
| institution | International Islamic University Malaysia |
| language | English |
| last_indexed | 2024-03-05T23:12:33Z |
| publishDate | 2012 |
| publisher | Trans Tech Publications, Switzerland |
| record_format | dspace |
| spelling | oai:generic.eprints.org:284632015-08-18T06:15:58Z http://irep.iium.edu.my/28463/ Development of an economical lapping process Konneh, Mohamed Tamsir, Afzeri Triblas Adesta, Erry Yulian TJ1125 Machine shops and machine shop practice The manufacturing of silicon wafers in particular involves numerous processes such as grinding, lapping, and polishing of large diameter wafers employing expensive equipment in order to produce the required optical quality and damage-free surfaces. In the finishing of thin silicon chips for making IC chips especially, it is difficult to lap and polish the substrate and obtain low surface integrity, surface finish and at the same time generate flat planar surfaces. This paper presents the development of a low cost lapping process, the process tried out on thin silicon chips that generated fracture-free with mirror-like surfaces of low roughness values and reasonably high degree of flatness. Trans Tech Publications, Switzerland 2012 Article PeerReviewed application/pdf en http://irep.iium.edu.my/28463/2/DEVELOPMENT_OF_AN_ECONOMICAL_LAPPING_PROCESS.pdf Konneh, Mohamed and Tamsir, Afzeri and Triblas Adesta, Erry Yulian (2012) Development of an economical lapping process. Advanced Materials Research, 472-47. pp. 2348-2353. ISSN 1022-6680 http://www.scientific.net/AMR.472-475.2348 |
| spellingShingle | TJ1125 Machine shops and machine shop practice Konneh, Mohamed Tamsir, Afzeri Triblas Adesta, Erry Yulian Development of an economical lapping process |
| title | Development of an economical lapping process |
| title_full | Development of an economical lapping process |
| title_fullStr | Development of an economical lapping process |
| title_full_unstemmed | Development of an economical lapping process |
| title_short | Development of an economical lapping process |
| title_sort | development of an economical lapping process |
| topic | TJ1125 Machine shops and machine shop practice |
| url | http://irep.iium.edu.my/28463/2/DEVELOPMENT_OF_AN_ECONOMICAL_LAPPING_PROCESS.pdf |
| work_keys_str_mv | AT konnehmohamed developmentofaneconomicallappingprocess AT tamsirafzeri developmentofaneconomicallappingprocess AT triblasadestaerryyulian developmentofaneconomicallappingprocess |