MEMS and EFF technology based micro connector for future miniature devices
The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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IOP Publishing
2013
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/34443/1/MEMS_and_EFF_technology_based_micro_connector_for_future_miniature_devices.pdf |
| _version_ | 1825647771838840832 |
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| author | Bhuiyan, Moinul Alamgir, Tarik Bhuiyan, Munira Kajihara, Masanori |
| author_facet | Bhuiyan, Moinul Alamgir, Tarik Bhuiyan, Munira Kajihara, Masanori |
| author_sort | Bhuiyan, Moinul |
| collection | IIUM |
| description | The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique. |
| first_indexed | 2024-03-05T23:22:31Z |
| format | Article |
| id | oai:generic.eprints.org:34443 |
| institution | International Islamic University Malaysia |
| language | English |
| last_indexed | 2024-03-05T23:22:31Z |
| publishDate | 2013 |
| publisher | IOP Publishing |
| record_format | dspace |
| spelling | oai:generic.eprints.org:344432014-07-03T07:43:03Z http://irep.iium.edu.my/34443/ MEMS and EFF technology based micro connector for future miniature devices Bhuiyan, Moinul Alamgir, Tarik Bhuiyan, Munira Kajihara, Masanori TA401 Materials of engineering and construction The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique. IOP Publishing 2013 Article PeerReviewed application/pdf en http://irep.iium.edu.my/34443/1/MEMS_and_EFF_technology_based_micro_connector_for_future_miniature_devices.pdf Bhuiyan, Moinul and Alamgir, Tarik and Bhuiyan, Munira and Kajihara, Masanori (2013) MEMS and EFF technology based micro connector for future miniature devices. IOP Conference Series: Materials Science and Engineering, 53. 012063-1. ISSN 1757-8981 http://iopscience.iop.org/1757-899X/53/1/012063 10.1088/1757-899X/53/1/012063 |
| spellingShingle | TA401 Materials of engineering and construction Bhuiyan, Moinul Alamgir, Tarik Bhuiyan, Munira Kajihara, Masanori MEMS and EFF technology based micro connector for future miniature devices |
| title | MEMS and EFF technology based micro connector for future miniature devices |
| title_full | MEMS and EFF technology based micro connector for future miniature devices |
| title_fullStr | MEMS and EFF technology based micro connector for future miniature devices |
| title_full_unstemmed | MEMS and EFF technology based micro connector for future miniature devices |
| title_short | MEMS and EFF technology based micro connector for future miniature devices |
| title_sort | mems and eff technology based micro connector for future miniature devices |
| topic | TA401 Materials of engineering and construction |
| url | http://irep.iium.edu.my/34443/1/MEMS_and_EFF_technology_based_micro_connector_for_future_miniature_devices.pdf |
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