Predicting the crack initiation fracture toughness for a crack along the bimaterial interface

Three Point Bend (3PB) bimaterial specimens of PMMA/PC were made by joining the two materials using friction welding. The specimens were tested and the crack initiation loads were recorded to evaluate the K using ASTM standard E 1820-01. Stress field in the crack tip vicinity was studied using finit...

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Main Authors: Shah, Qasim Hussain, Azram, Mohammad, Iliyas, M. H.
Format: Article
Language:English
Published: Asian Network for Scientific Information 2005
Subjects:
Online Access:http://irep.iium.edu.my/5658/1/253-256.pdf
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author Shah, Qasim Hussain
Azram, Mohammad
Iliyas, M. H.
author_facet Shah, Qasim Hussain
Azram, Mohammad
Iliyas, M. H.
author_sort Shah, Qasim Hussain
collection IIUM
description Three Point Bend (3PB) bimaterial specimens of PMMA/PC were made by joining the two materials using friction welding. The specimens were tested and the crack initiation loads were recorded to evaluate the K using ASTM standard E 1820-01. Stress field in the crack tip vicinity was studied using finite element IC analysis of the specimen model. Normal and shear stresses were recorded for a series of nodes ahead of the crack tip at (2=0°). SIF values were calculated using these stress values and it was found that the stresses at a certain distance lying outside the process zone provide a SIF value matching to that of experimental fracture toughness of the specimen under study. Based upon the experimental evidence and finite element analysis, a simple step by step procedure is proposed to calculate the fracture toughness of bimaterials for a complex stress field.
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spelling oai:generic.eprints.org:56582013-07-17T07:34:22Z http://irep.iium.edu.my/5658/ Predicting the crack initiation fracture toughness for a crack along the bimaterial interface Shah, Qasim Hussain Azram, Mohammad Iliyas, M. H. TJ227 Machine design and drawing Three Point Bend (3PB) bimaterial specimens of PMMA/PC were made by joining the two materials using friction welding. The specimens were tested and the crack initiation loads were recorded to evaluate the K using ASTM standard E 1820-01. Stress field in the crack tip vicinity was studied using finite element IC analysis of the specimen model. Normal and shear stresses were recorded for a series of nodes ahead of the crack tip at (2=0°). SIF values were calculated using these stress values and it was found that the stresses at a certain distance lying outside the process zone provide a SIF value matching to that of experimental fracture toughness of the specimen under study. Based upon the experimental evidence and finite element analysis, a simple step by step procedure is proposed to calculate the fracture toughness of bimaterials for a complex stress field. Asian Network for Scientific Information 2005 Article PeerReviewed application/pdf en http://irep.iium.edu.my/5658/1/253-256.pdf Shah, Qasim Hussain and Azram, Mohammad and Iliyas, M. H. (2005) Predicting the crack initiation fracture toughness for a crack along the bimaterial interface. Journal of Applied Sciences, 5 (2). pp. 253-256. ISSN 1812-5654 http://scialert.net/abstract/?doi=jas.2005.253.256
spellingShingle TJ227 Machine design and drawing
Shah, Qasim Hussain
Azram, Mohammad
Iliyas, M. H.
Predicting the crack initiation fracture toughness for a crack along the bimaterial interface
title Predicting the crack initiation fracture toughness for a crack along the bimaterial interface
title_full Predicting the crack initiation fracture toughness for a crack along the bimaterial interface
title_fullStr Predicting the crack initiation fracture toughness for a crack along the bimaterial interface
title_full_unstemmed Predicting the crack initiation fracture toughness for a crack along the bimaterial interface
title_short Predicting the crack initiation fracture toughness for a crack along the bimaterial interface
title_sort predicting the crack initiation fracture toughness for a crack along the bimaterial interface
topic TJ227 Machine design and drawing
url http://irep.iium.edu.my/5658/1/253-256.pdf
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