Utilization of polyproylene synthetic aggregate and epoxy resin for chip sealing

Utilization of polyproylene synthetic aggregate and epoxy resin for chip sealing

Bibliographic Details
Main Authors:	, YOGASWORO, Swadarma, , Dr. Ir. Latif Budi Suparma, M.Sc
Format:	Thesis
Published:	[Yogyakarta] : Universitas Gadjah Mada 2009
Subjects:	ETD

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