Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan
This paper presents the simulation of three dimensional numerical analyses of heat and fluid flow through chip package. 3D model of chip packages is built using GAMBIT and simulated using FLUENT software. The study was made for four chip packages arranged in line under different types of materials,...
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| Format: | Article |
| Language: | English |
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Research Management Institute (RMI)
2011
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| Online Access: | https://ir.uitm.edu.my/id/eprint/12941/1/AJ_MAZLAN%20MOHAMED%20SRJ%2011%201.pdf |
| _version_ | 1825734079264325632 |
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| author | Mohamed, Mazlan Atan, Rahim |
| author_facet | Mohamed, Mazlan Atan, Rahim |
| author_sort | Mohamed, Mazlan |
| collection | UITM |
| description | This paper presents the simulation of three dimensional numerical analyses of heat and fluid flow through chip package. 3D model of chip packages is built using GAMBIT and simulated using FLUENT software. The study was made for four chip packages arranged in line under different types
of materials, inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature and thermal resistance of each package The comparison between three types of material in terms of
junction temperature has been observed and it was found that the junction temperature of the nano-silver had the lowest junction temperature as compared to epoxy and composite polymer. It also found that the nanosilver had the highest value of thermal conductivity as compared to the
others. The strength of CFD software in handling heat transfer problems is proved to be excellent. |
| first_indexed | 2024-03-06T01:26:26Z |
| format | Article |
| id | oai:ir.uitm.edu.my:12941 |
| institution | Universiti Teknologi MARA |
| language | English |
| last_indexed | 2024-03-06T01:26:26Z |
| publishDate | 2011 |
| publisher | Research Management Institute (RMI) |
| record_format | dspace |
| spelling | oai:ir.uitm.edu.my:129412016-05-30T02:19:31Z https://ir.uitm.edu.my/id/eprint/12941/ Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan srj Mohamed, Mazlan Atan, Rahim Numerical simulation. Monte Carlo method Thermal conductivity This paper presents the simulation of three dimensional numerical analyses of heat and fluid flow through chip package. 3D model of chip packages is built using GAMBIT and simulated using FLUENT software. The study was made for four chip packages arranged in line under different types of materials, inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature and thermal resistance of each package The comparison between three types of material in terms of junction temperature has been observed and it was found that the junction temperature of the nano-silver had the lowest junction temperature as compared to epoxy and composite polymer. It also found that the nanosilver had the highest value of thermal conductivity as compared to the others. The strength of CFD software in handling heat transfer problems is proved to be excellent. Research Management Institute (RMI) 2011 Article PeerReviewed text en https://ir.uitm.edu.my/id/eprint/12941/1/AJ_MAZLAN%20MOHAMED%20SRJ%2011%201.pdf Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan. (2011) Scientific Research Journal <https://ir.uitm.edu.my/view/publication/Scientific_Research_Journal/>, 8 (1). pp. 29-39. ISSN 1675-7009 https://srj.uitm.edu.my/ |
| spellingShingle | Numerical simulation. Monte Carlo method Thermal conductivity Mohamed, Mazlan Atan, Rahim Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan |
| title | Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan |
| title_full | Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan |
| title_fullStr | Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan |
| title_full_unstemmed | Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan |
| title_short | Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan |
| title_sort | three dimensional cfd simulations of junction temperature of electronic components using nano silver mazlan mohamed and rahim atan |
| topic | Numerical simulation. Monte Carlo method Thermal conductivity |
| url | https://ir.uitm.edu.my/id/eprint/12941/1/AJ_MAZLAN%20MOHAMED%20SRJ%2011%201.pdf |
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