A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits
In this paper an outline of X band and S band thick film active phased array modules, based on the phased locked principle, are presented.
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
IEE (Professional group E12)
1980
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Subjects: | |
Online Access: | https://repository.londonmet.ac.uk/5290/1/P8.pdf |
_version_ | 1804072446809079808 |
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author | Brinson, Mike Forrest, J. R. Parsons, A. J. Salles, A. A. |
author_facet | Brinson, Mike Forrest, J. R. Parsons, A. J. Salles, A. A. |
author_sort | Brinson, Mike |
collection | LMU |
description | In this paper an outline of X band and S band thick film active phased array modules, based on the phased locked principle, are presented. |
first_indexed | 2024-07-09T03:59:17Z |
format | Article |
id | oai:repository.londonmet.ac.uk:5290 |
institution | London Metropolitan University |
language | English |
last_indexed | 2024-07-09T03:59:17Z |
publishDate | 1980 |
publisher | IEE (Professional group E12) |
record_format | eprints |
spelling | oai:repository.londonmet.ac.uk:52902019-11-07T09:15:46Z http://repository.londonmet.ac.uk/5290/ A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits Brinson, Mike Forrest, J. R. Parsons, A. J. Salles, A. A. 620 Engineering & allied operations In this paper an outline of X band and S band thick film active phased array modules, based on the phased locked principle, are presented. IEE (Professional group E12) 1980-05-07 Article PeerReviewed text en https://repository.londonmet.ac.uk/5290/1/P8.pdf Brinson, Mike, Forrest, J. R., Parsons, A. J. and Salles, A. A. (1980) A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits. Colloquim on Thick-film microwave integrated circuits. 5/1-5/4. |
spellingShingle | 620 Engineering & allied operations Brinson, Mike Forrest, J. R. Parsons, A. J. Salles, A. A. A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits |
title | A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits |
title_full | A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits |
title_fullStr | A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits |
title_full_unstemmed | A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits |
title_short | A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits |
title_sort | comparison of au ag pd ag and cu thick film microwave integrated circuits |
topic | 620 Engineering & allied operations |
url | https://repository.londonmet.ac.uk/5290/1/P8.pdf |
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