A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits

In this paper an outline of X band and S band thick film active phased array modules, based on the phased locked principle, are presented.

Bibliographic Details
Main Authors: Brinson, Mike, Forrest, J. R., Parsons, A. J., Salles, A. A.
Format: Article
Language:English
Published: IEE (Professional group E12) 1980
Subjects:
Online Access:https://repository.londonmet.ac.uk/5290/1/P8.pdf
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author Brinson, Mike
Forrest, J. R.
Parsons, A. J.
Salles, A. A.
author_facet Brinson, Mike
Forrest, J. R.
Parsons, A. J.
Salles, A. A.
author_sort Brinson, Mike
collection LMU
description In this paper an outline of X band and S band thick film active phased array modules, based on the phased locked principle, are presented.
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publisher IEE (Professional group E12)
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spelling oai:repository.londonmet.ac.uk:52902019-11-07T09:15:46Z http://repository.londonmet.ac.uk/5290/ A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits Brinson, Mike Forrest, J. R. Parsons, A. J. Salles, A. A. 620 Engineering & allied operations In this paper an outline of X band and S band thick film active phased array modules, based on the phased locked principle, are presented. IEE (Professional group E12) 1980-05-07 Article PeerReviewed text en https://repository.londonmet.ac.uk/5290/1/P8.pdf Brinson, Mike, Forrest, J. R., Parsons, A. J. and Salles, A. A. (1980) A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits. Colloquim on Thick-film microwave integrated circuits. 5/1-5/4.
spellingShingle 620 Engineering & allied operations
Brinson, Mike
Forrest, J. R.
Parsons, A. J.
Salles, A. A.
A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits
title A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits
title_full A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits
title_fullStr A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits
title_full_unstemmed A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits
title_short A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits
title_sort comparison of au ag pd ag and cu thick film microwave integrated circuits
topic 620 Engineering & allied operations
url https://repository.londonmet.ac.uk/5290/1/P8.pdf
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