Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing
The effect of metallization chemistry on the solid state growth kinetics of intermetallics formed in an industrial metallization/solder/metallization arrangement during isothermal ageing has been studied. During isothermal ageing of the Cu/Sn-Ag-Cu/Cu arrangement at temperatures lower than 125 °C, C...
| Päätekijät: | , , |
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| Aineistotyyppi: | Journal article |
| Kieli: | English |
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Elsevier
2014
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