Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing

Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing

The effect of metallization chemistry on the solid state growth kinetics of intermetallics formed in an industrial metallization/solder/metallization arrangement during isothermal ageing has been studied. During isothermal ageing of the Cu/Sn-Ag-Cu/Cu arrangement at temperatures lower than 125 °C, C...

Podrobná bibliografie
Hlavní autoři:	Marques, V, Johnston, C, Grant, P
Médium:	Journal article
Jazyk:	English
Vydáno:	Elsevier 2014

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