Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing

Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing

The effect of metallization chemistry on the solid state growth kinetics of intermetallics formed in an industrial metallization/solder/metallization arrangement during isothermal ageing has been studied. During isothermal ageing of the Cu/Sn-Ag-Cu/Cu arrangement at temperatures lower than 125 °C, C...

Бүрэн тодорхойлолт

Номзүйн дэлгэрэнгүй
Үндсэн зохиолчид:	Marques, V, Johnston, C, Grant, P
Формат:	Journal article
Хэл сонгох:	English
Хэвлэсэн:	Elsevier 2014

Ижил төстэй зүйлс

Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes /
-н: 323613 Azizah Wahi, зэрэг
Хэвлэсэн: (2007)

Microstructure evolution at the interface between Cu and eutectic Sn–Bi alloy with the addition of Ag or Ni
-н: Minho O, зэрэг
Хэвлэсэн: (2023-09-01)

Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes [electronic resource] /
-н: 323613 Azizah Wahi
Хэвлэсэн: (2007)

Influence of carbon nanotubes on the morphology of Cu6Sn5 in Cu/(Sn–Ag–Cu) solder joints
-н: Minho Oh, зэрэг
Хэвлэсэн: (2024-03-01)

Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density
-н: Bo Wang, зэрэг
Хэвлэсэн: (2022-01-01)

Reactive diffusion at the interface between Cu and Sn–Ag alloys
-н: Minho Oh, зэрэг
Хэвлэсэн: (2024-05-01)

Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints under current stressing
-н: Bo Wang, зэрэг
Хэвлэсэн: (2024-09-01)

Interface Growth and Void Formation in Sn/Cu and Sn0.7Cu/Cu Systems
-н: Jieshi Chen, зэрэг
Хэвлэсэн: (2018-12-01)

Nanomechanical characterization of Sn-Ag-Cu/Cu joints - Part 1: Young's modulus, hardness and deformation mechanisms as a function of temperature
-н: Marques, V, зэрэг
Хэвлэсэн: (2013)

Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 1: Young's modulus, hardness and deformation mechanisms as a function of temperature
-н: Marques, V, зэрэг
Хэвлэсэн: (2013)

Thermodynamic Modeling of the Ag-Cu-Sn Ternary System
-н: Qingsong Tong, зэрэг
Хэвлэсэн: (2022-09-01)

Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
-н: Chia, P.Y., зэрэг
Хэвлэсэн: (2016)

Nanomechanical characterization of Sn-Ag-Cu/Cu joints - Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature
-н: Marques, V, зэрэг
Хэвлэсэн: (2013)

Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature
-н: Marques, V, зэрэг
Хэвлэсэн: (2013)

Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
-н: M.A., Rabiatul Adawiyah, зэрэг
Хэвлэсэн: (2018)

A review on mechanical properties of SnAgCu/Cu joint using laser soldering
-н: Nabila, Tamar Jaya, зэрэг
Хэвлэсэн: (2018)

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review
-н: Liu Mei Lee, зэрэг
Хэвлэсэн: (2013-01-01)

Kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian Sn-Ag-Cu/cnt/cu menggunakan pelekukan nano (Effect of isothermal aging on microhardness properties of Sn-Ag-Cu/CNT/Cu using nanoindentation)
-н: Ismail, Norliza, зэрэг
Хэвлэсэн: (2019)

Influence of Sn on Microstructure and Performance of Electric Vacuum Ag-Cu Filler Metal
-н: SHI Lei, зэрэг
Хэвлэсэн: (2016-10-01)

Grain refinement of primary Cu6Sn5 in the Sn-3wt%Ag-5wt%Cu alloy by Ge
-н: C.Y. Tan, зэрэг
Хэвлэсэн: (2022-11-01)

Effect of Cooling Rate on the Longitudinal Modulus of Cu3Sn Phase of Ag-Sn-Cu Amalgam Alloy (Part I)
-н: R. H. Rusli
Хэвлэсэн: (2015-10-01)

Effect of Cooling Rate on the Longitudinal Modulus of Cu3Sn Phase of Ag-Sn-Cu Amalgam Alloy (Part II)
-н: R. H. Rusli
Хэвлэсэн: (2015-10-01)

Characteristics Of Sn-Zn Cast Alloys With The Addition Of Ag And Cu
-н: Gancarz T., зэрэг
Хэвлэсэн: (2015-09-01)

Fracture of Sn-Ag-Cu solder joints on Cu substrates : I. effects of loading and processing conditions
-н: Pang, John Hock Lye, зэрэг
Хэвлэсэн: (2013)

VISCOSITY OF CuPb, CuPbSn, CuPbSnGa AND CuPbSnGaBi MELTS OF EQUIATOMIC COMPOSITIONS
-н: Olga Chikova, зэрэг
Хэвлэсэн: (2019-03-01)

Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
-н: Nai, S. M. L., зэрэг
Хэвлэсэн: (2013)

The influences of Ag nanoparticles on voids growth and solderability about Sn3.0Ag0.5Cu/Cu solder joint
-н: Lingyan Zhao, зэрэг
Хэвлэсэн: (2024-01-01)

Синтез эвтектических сплавов Sn − Ag и Sn – Ag – Cu безэлектролизным осаждением из пирофосфатных растворов
-н: Анна Михайловна Рабенок, зэрэг
Хэвлэсэн: (2023-09-01)

Effect of Ni/Sn ratio on microstructure and properties of Cu-Ni-Sn-P alloy
-н: Xiaokang Chen, зэрэг
Хэвлэсэн: (2024-12-01)

Effect of microwave hybrid susceptors on the interface morphology, mechanical properties and fracture morphology of Cu/nano-Sn-3.0Ag-0.5Cu/Cu joints
-н: Shuai Zhang, зэрэг
Хэвлэсэн: (2024-01-01)

Development of Low Silver AgCuZnSn Filler Metal for Cu/Steel Dissimilar Metal Joining
-н: Peng Xue, зэрэг
Хэвлэсэн: (2019-02-01)

Mechanics of Sn-4Ag-0.5Cu solder joints in a ball grid array assembly during reflow and temperature cycles /
-н: Lai, Zheng Bo, 1984-, author, зэрэг
Хэвлэсэн: (2008)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
-н: Tai, Siew Fong
Хэвлэсэн: (2003)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish /
-н: 399565 Tai, Siew Fong
Хэвлэсэн: (2003)

Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
-н: Siti Rabiatull Aisha, Idris, зэрэг
Хэвлэсэн: (2023)

Properties of Sn-Ag-Cu Solder Joints Prepared by Induction Heating
-н: Marian Drienovsky, зэрэг
Хэвлэсэн: (2020-01-01)

The colour of AuAgCu alloys
-н: Hunt, Robert
Хэвлэсэн: (1983)

Microstructure and Fatigue Behavior of a Ni-Cu-Sn Alloy
-н: Leonardo Bertini, зэрэг
Хэвлэсэн: (2018-10-01)

Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film
-н: Haseeb, A.S. Md. Abdul, зэрэг
Хэвлэсэн: (2018)

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging
-н: Lei Sun, зэрэг
Хэвлэсэн: (2015-01-01)